HP xw2x220c Blade manual Delivery survey

Page 64

28.

Can cooling be maintained between 20ºC and 55ºC (up to

 

 

 

 

5000 ft)? Derate 1º C/1000 ft above 5000 ft and up to

 

 

 

 

10,000 ft.

 

 

 

 

 

 

 

 

29.

Can temperature changes be held to 10ºC/h with tape

 

 

 

 

media? Can temperature changes be held to 20ºC/h

 

 

 

 

without tape media?

 

 

 

 

 

 

 

 

30.

Can humidity levels be maintained at 40% to 60% at 35ºC

 

 

 

 

noncondensing?

 

 

 

 

 

 

 

 

31.

Are air conditioning filters installed and clean?

 

 

 

 

 

 

 

 

 

Storage

 

 

 

 

 

 

 

 

32.

Are cabinets available for tape and disc media?

 

 

 

 

 

 

 

 

33.

Is shelving available for documentation?

 

 

 

 

 

 

 

 

 

Training

 

 

 

 

 

 

 

 

34.

Are personnel enrolled in the System Administrator's

 

 

 

 

Course?

 

 

 

 

 

 

 

 

35.

Is on-site training required?

 

 

 

 

 

 

 

 

Delivery survey

Special instructions or recommendations should be entered on the special instructions or recommendations form. The following list gives examples of special instructions or issues:

Packaging restrictions at the facility, such as size and weight limitations

Special delivery procedures

Special equipment required for installation, such as tracking or hoists

What time the facility is available for installation (after the equipment is unloaded)

Special security requirements applicable to the facility, such as security clearance

Dock delivery

 

 

 

Is the dock large enough for a semitrailer?

Yes or No

 

 

Location of the dock:

North, south, east, or west

 

 

Street name if different than company address:

 

 

 

Street delivery

 

 

 

Location of the access door:

North, south, east, or west

 

 

Street name if different than company address:

 

 

 

Height of access door:

 

 

 

Width of access door:

 

 

 

Special permits (list type and agency obtained

 

from):

 

 

 

 

 

 

 

 

 

Preparing for installation 64

Image 64
Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support About this document IntroductionRelated documentation Ashrae guidelines for site planning General site preparation guidelinesHP site planning assistance Site planning considerations Computer room preparationPage Air conditioning system specifications Basic air distribution systemsCabling requirements Air conditioning ductsRaised floor loading Floor loadingAverage floor loading Computer room safety Installation and maintenance precautionsFire protection Fire suppressionWorking space for component access Lighting requirements for equipment servicingEnvironmental requirements Environmental elementsHumidity level Dust and pollutionMetallic particulate contamination Acoustic noise specification Electrostatic discharge preventionRecommended operating environment AshraeAirflow requirements Space requirementsBlanking panels HP Rack Airflow Optimization KitOperational space requirements Delivery space requirementsEquipment clearance and floor loading Floor plan grid Rack and accessory footprints HP BladeSystem enclosure environmental specificationsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Rack placement and arrangement for proper airflow Third-party racksRack tie-down option kit Power requirements Power requirements and considerationsElectrical factors Power consumption Electrical load requirements circuit breaker sizing Power quality Power considerationsFactors affecting power quality Power system protectionPower options Power redundancyNon-redundant power Wire selectionDistribution hardware Line voltage selectionGrounding requirements Grounding systemsRaceway systems electrical conduits Lahj Building distributionPower distribution safety grounding Lahj Power panel groundComputer safety ground Dual power source groundingCabinet performance grounding high frequency ground Raised floor high-frequency noise groundingWiring connections System installation guidelinesEquipment grounding implementation details Power configuration Dynamic Power CappingHP BladeSystem enclosure single-phase power configuration Data communications cablesPower requirements and considerations Power requirements and considerations Power requirements and considerations PDU installation C7000 PDU exampleC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem enclosure DC power configuration HP BladeSystem c7000 Enclosure DC configurationSingle-phase HP 2250W Power Supply specification Power supply specificationsHP BladeSystem c3000 Enclosure DC configuation Specification Value Specification Value DC power supply specification Hardware specifications and requirements Enclosure specificationsHP BladeSystem c7000 Enclosure specifications HP BladeSystem c3000 Enclosure specificationsHP 10000 G2 rack specifications Rack requirementsRack-free environment requirements Configuration scenarios Example configurationsExample minimum configuration Example typical configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation General component placement guidelines Additional rack considerationsRack configuration software Sample installation schedule Sample checklistsIs there a completed floor plan? Delivery survey Page Conversion factors Conversion factors and formulasFormulas Before you contact HP Technical supportHP contact information Acronyms and abbreviations UPS Apparent power GlossaryKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.