Ampro Corporation 486E Enhanced Reliability

Introduction

1–5

The Little Board/486e CPU provides a PC/104-compa tible e xpan sion bu s fo r add ition al sy stem

functions. This bus is a compact version of the stand ard PC I SA bu s and offe rs comp act, self-

stacking, modular expandability. The growing list of PC/104 modules available from Ampro and

other PC/104 vendors includes such functions as:

! Communications interfaces

! Video frame grabbers

! Field bus interfaces

! Digital signal processors (DSPs)

! Data acquisition and control functions

! Many specialized interfaces and controllers

In addition, customized, application-specific logic boards can be stacked on top of the

Little Board/486e CPU using the PC/104 expan sion bu s in terface as a ru gge d and relia ble

interconnect. The PC/104 bus is an embedded system version of the signal set provided on a

desktop PC’s ISA bus.

Enhanced Reliability

Ampro specializes in producing highly reliable embedded system computers and peripherals

capable of withstanding hostile, mission-critical environments without operator intervention.

Ampro’s system designs and a comprehensive testing program have evolved to ensure a reliable

and stable system for use in these harsh and demanding applications.

ISO 9001 Manufacturing. Ampro is a certified ISO 9001 vendor.

Regulatory testing. Knowing that many embedded systems must qualify under EMC emissions

susceptibility testing, Ampro designs bo ard s with car eful atte ntion to EMI i ssu es. Bo ard s are

tested in standard enclosures to ensure that they can pass such emissions tests. Tests include the

following CE MARK European Union directives:

! EN55022 and EN55011 (for EMC)

! EN61000-4-2 (for ESD)

! EN61000-4-6 (for RF Susceptibility)

! EN61000-4-4 (For EFT)

Tests also include emissions testing at U S vo ltag es per FC C Par t 15, Subpar t J. The test lev els are

CISPR Class A / VCCI1, Light Industrial.

Wide-range temperature testing. Ampro Engineering qualifies all of its desig ns by e xten sive

thermal and voltage margin testing.

3.3V CPU for greater high temperature tolerance. The board uses the latest low-voltage CPU

technology to extend its temperature range and reduce cooling requirements.

Shock and Vibration Testing. Boards intended for use in harsh environments are designed for

shock and vibration durability to MIL-STD 202F , Meth od 2 14A, T able 214I, Cond ition D at 5

minutes per axis for random vibration, and to MIL- STD 202 F, Me thod 2 13B , Ta ble 213- 1,

Condition A for resistance to mechanical shock.