CY7C1380C
CY7C1382C
Document #: 38-05237 Rev. *D Page 27 of 36
Switching Characteristics Over the Operating Range[19, 20]
Parameter Description
250 MHz 225 MHz 200 MHz 167 MHz 133 MHz
UnitMin. Max Min. Max Min. Max
tPOWER VDD(Typical) to the first Access[15] 11111ms
Clock
tCYC Clock Cycle Time 4.0 4.4 5 6 7.5 ns
tCH Clock HIGH 1.7 2.0 2.0 2.2 2.5 ns
tCL Clock LOW 1.7 2.0 2.0 2.2 2.5 ns
Output Times
tCO Data Output Valid After CLK Rise 2.6 2.8 3.0 3.4 4.2 ns
tDOH Data Output Hold After CLK Rise 1.0 1.0 1.3 1.3 1.3 ns
tCLZ Clock to Low-Z[16, 17, 18] 1.0 1.0 1.3 1.3 1.3 ns
tCHZ Clock to High-Z[16, 17, 18] 2.6 2.8 3.0 3.4 3.4 ns
tOEV OE LOW to Output Valid 2.6 2.8 3.0 3.4 4.2 ns
tOELZ OE LOW to Output Low-Z[16, 17, 18] 00000ns
tOEHZ OE HIGH to Output High-Z[16, 17, 18] 2.6 2.8 3.0 3.4 4.0 ns
Setup Times
tAS Address Set-up Before CLK Rise 1.2 1.4 1.4 1.5 1.5 ns
tADS ADSC, ADSP Set-up Before CLK
Rise 1.2 1.4 1.4 1.5 1.5 ns
tADVS ADV Set-up Before CLK Rise 1.2 1.4 1.4 1.5 1.5 ns
tWES GW, BWE, BWX Set-up Before CLK
Rise 1.2 1.4 1.4 1.5 1.5 ns
tDS Data Input Set-up Before CLK Rise 1.2 1.4 1.4 1.5 1.5 ns
tCES Chip Enable Set-Up Before CLK Rise 1.2 1.4 1.4 1.5 1.5 ns
Hold Times
tAH Address Hold After CLK Rise 0.3 0.4 0.4 0.5 0.5 ns
tADH ADSP , ADSC Hold After CLK Rise 0.3 0.4 0.4 0.5 0.5 ns
tADVH ADV Hold After CLK Rise 0.3 0.4 0.4 0.5 0.5 ns
tWEH GW,BWE, BWX Hold After CLK Rise 0.3 0.4 0.4 0.5 0.5 ns
tDH Data Input Hold After CLK Rise 0.3 0.4 0.4 0.5 0.5 ns
tCEH Chip Enable Hold After CLK Rise 0.3 0.4 0.4 0.5 0.5 ns
Shaded areas contain advance information.
Notes:
15.This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD( minimum) initially before a read or write operation
can be initiated.
16.tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.
17.At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same
data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed
to achieve High-Z prior to Low-Z under the same system conditions
18.This parameter is sampled and not 100% tested.
19.Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.
20.Test conditions shown in (a) of AC Test Loads unless otherwise noted.
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