ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings are the maximum physical and electrical ratings of a device beyond which performance degradation or damage will occur. Always check circuit conditions before using a device to avoid exceeding these ratings. Typically, absolute maximum ratings include the following parameters.
1.Power supply voltage
Steady state applied voltages, noise, reverse voltage transients and
2.Input signal voltage
Input signals exceeding this rate can damage input protection circuits
3.Output current
Generally, specifications are not set for CMOS devices with small output currents. Devices that provide large drive currents will have output cur- rent specifications.
4.Power dissipation
The maximum power dissipation of a device is limited by its construction and package type. Maximum output current limits are set to prevent thermal damage.
5.Operating temperature range
The temperature range for normal device operation with no change in performance characteristics.
6.Storage temperature range
The temperature range for device storage with no degradation or damage. This specification is par- ticularly important when ICs are being transported by air.
7.Soldering temperature and the duration
The maximum soldering temperature and the time for which the leads can be at this temperature.
RECOMMENDED OPERATING CONDITIONS
Recommended operating conditions are the conditions under which a device functions correctly. These include power supply voltage, input conditions and output current. These conditions are sometimes listed as part of the electrical characteristics.
ELECTRICAL CHARACTERISTICS
Electrical characteristics specify the DC and AC characteristics of a device under the worst measurement conditions.
Appendix
POWER DISSIPATION CONDITIONSTo prevent damage always consider the following points when designing with power regulation ICs.
1.A precise thermal design is necessary to ensure adequate heat dissipation.
The following figure shows the power dissipation capacity in relation to ambient temperature.
| 3 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||
|
|
| 25 x 80 x 0.7 mm3 ceramic substrate |
|
| |||||
(W) |
|
|
|
|
|
|
|
|
|
|
|
|
| 12.5 x 40 x 0.7 mm3 |
|
|
|
| |||
dissipation | 2 |
|
| ceramic substrate |
|
|
| |||
|
|
|
| 12.5 x 20 x 0.7 mm3 |
|
|
| |||
|
|
|
|
|
|
|
|
| ||
|
|
|
|
|
| ceramic substrate or |
|
|
| |
|
|
|
|
|
| 1.7 mm thick | ||||
|
|
|
|
|
| substrate with 1 cm2 |
|
| ||
Power | 1 |
|
|
|
| collector surface area |
|
| ||
0.5 mm thick substrate |
|
| ||||||||
|
|
|
|
|
|
|
|
|
| |
| 0 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
|
| 100 |
|
| 150 | ||||
| 50 |
|
| |||||||
Ambient temperature (˚C)
The following figure shows the cost and reliability of a product and is significant when designing a system.
| Reliability |
| Cost |
Cost | Reliability |
Junction temperature
Appendix
S1F70000 Series Technical Manual
EPSON |