Epson S1F70000 PARAMETER SUMMARY

Appendix

The following figure shows a thermal design model which can be used to determine heatsink capacity.

Junction

Tj temperature

θjc

Case

Tc temperature

Heat	θcs
source

Ts	Heatsink
	temperature

θsa

Ambient

Ta temperature

2.Ensure that the regulator common pin is a sin- gle-point ground to prevent earth loops. Make ground lines as thick and short as possible. Use the specified bypass capacitors for inputs and outputs. If there is a switching load, use a tantalum or ceramic capacitor, as these devices have a high frequency response between the power supply and ground.

PARAMETER SUMMARY

Symbol	Parameter
CD	Drain capacitance
CF8	Field slew capacitance
CG	Gate capacitance
CI	Input capacitance
Cn	Capacitance
CT	Crosstalk
CTn	Temperature gradient
fCLK	Clock frequency
fmax	Maximum clock frequency
fOSC	Oscillator frequency
FT	Field through (channel OFF)
IBSQ	Backup switching leakage current
IDDO	Operating current
IDDS	Standby current
IDD	Power supply current
IIH	High-level input current
IIL	Low-level input current
ILKI	input leakage current
IMAX	Maximum current
IO	Output current
IOH	High-level output current
IOL	Low-level output current
IOPR1	Multiplier circuit power dissipation

Symbol	Parameter
IOPR2	Stabilization circuit power dissipation
IQ	Quiescent current
IR	Reverse current
ISWQ	Switching transistor leakage current
KI	Output voltage temperature gradient
PD	Power dissipation
Peff	Voltage multiplication efficiency
RBSON	Backup switch ON resistance
RL	Load resistance
RO	Output impedance
RON	ON resistance
ROSC	Oscillator network resistor
RRV	Stabilization voltage sensing resistor
RRVn	Reference voltage
RSAT	Stabilization output saturation resistance
RSWON	Switching transistor ON resistance
Ta	Ambient temperature
tAE	Minimum pulsewidth
tHA	Address hold time
tHD	Data hold time
THD	Total harmonic distortion
θjn	Thermal resistance
tMRR	Memory reset recovery time

6–2 EPSON

S1F70000 Series Technical Manual