Installation Requirements
3.6 Notes on Drive Handling
(1) General notes
Note the following points to maintain drive performance and reliability:
Device damage:
1)Shock or vibration applied to the drive that exceeds the values defined in the standard damage the drive. Use care when unpacking.
2)Do not leave the drive in dirty or contaminated environments.
3)Since static discharge may destroy the CMOS devices in the drive, pay attention to the following points after unpacking:
•Use an antistatic mat and wrist strap when handling the drive.
•Hold the mounting frame when handling the drive. Do not touch the Printed circuit board except when setting the switches.
4)When handling the drive, hold both sides of the mounting frame. When touching other than both sides of the mounting frame, avoid putting force.
5)Do not forcibly push up the end of the header pin of the printed circuit board unit when handling or setting the drive.
(2) Unpacking
a)Make sure that the UP label on the package is pointing upward and start unpacking on a level surface. Handle the drive on a soft surface such as a rubber mat, not on a hard surface such as a desk.
b)Use care to avoid exerting excessive pressure on the unit when removing the cushions.
c)Use care to avoid exerting excessive pressure on the printed circuit board surface and interface connectors when removing the drive from the antistatic bag.
d)If the temperature difference between installation locations is 10 degrees or more, leave the drive in the new location for at least two hours before unpackaging it.
