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E8500
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Thermal/Mechanical Design Guide
Models:
E8500
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Specs
Second NB Heatsink Assembly
Power Simulation Software
XMB Reference Thermal Solution
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Intel
®
E8500 Chipset North
Bridge (NB) and eXternal Memory
Bridge (XMB)
Thermal/Mechanical Design Guide
March 2005
Document Number
306749-001
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Contents
Thermal/Mechanical Design Guide
Intel E8500 Chipset North Bridge NB and eXternal Memory
Contents
Figures
Tables
Revision History
Design Flow
Introduction
BGA
Definition of Terms
XMB
Reference Documents
Introduction
TNB
Packaging Technology
NB Package Dimensions Bottom View
XMB Package Dimensions Top View
Package Mechanical Requirements
XMB Package Dimensions Bottom View
Thermal Design Power TDP
Thermal Specifications
Die Case Temperature Specifications
Intel E8500 Chipset XMB Thermal Specifications
Thermal Simulation
Thermal Simulation
Thermal Metrology
Die Case Temperature Measurements
Thermal Solution Decision Flowchart
Power Simulation Software
Thermal Metrology
Operating Environment
NB Reference Thermal Solution #1
Heatsink Performance
Mechanical Design Envelope
First NB Reference Heatsink Volumetric Envelope
Board-Level Components Keepout Dimensions
TNBLocation
First NB Heatsink Thermal Solution Assembly
Extruded Heatsink Profiles
Heatsink Retaining Fastener
Reliability Guidelines
Reliability Guidelines
NB Reference Thermal Solution #1
NB Reference Thermal Solution #2
NB Reference Thermal Solution #2
Second NB Reference Heatsink Volumetric Envelope
Second NB Heatsink Thermal Solution Assembly
Second NB Heatsink Assembly
Please refer to .6 for detail
NB Reference Thermal Solution #2
XMB Reference Thermal Solution
XMB Reference Heatsink Volumetric Envelope
XMB Heatsink Thermal Solution Assembly
XMB Location
Extruded Heatsink Profiles
XMB Heatsink Extrusion Profile
XMB Reference Thermal Solution
Table A-1 NB Heatsink Thermal Solution #1
Thermal Solution Component Suppliers
Table A-2 NB Heatsink Thermal Solution #2
Table A-3 XMB Heatsink Thermal Solution
Thermal Solution Component Suppliers
Table B-1. Mechanical Drawing List
Mechanical Drawings
Figure B-1. NB Heatsink #1 Assembly Drawing
Figure B-2. NB Heatsink #1 Drawing
Figure B-3. NB Heatsink #2 Assembly Drawing
Figure B-4. NB Heatsink #2 Drawing
Figure B-5. XMB Heatsink Assembly Drawing
Figure B-6. XMB Heatsink Drawing
Intel E8500 Chipset North Bridge NB and eXternal Memory
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