7NB Reference Thermal Solution #2
Intel has developed two different reference thermal solutions designed to meet the cooling needs of the E8500 chipset NB component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the 2nd NB reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions. For information on the Intel® 6700PXH 64-bit PCI Hub, refer to thermal specification in the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For information on the ICH5, refer to thermal specification in the Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide.
7.1Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of 52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 400 linear feet per minutes (lfm). The approaching airflow temperature is assumed to be equal to the local-ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C external-ambient temperature at sea level. (External-ambient refers to the environmental external to the system.)
The fastener for this reference thermal solution is intended to be used on motherboard with thickness between 0.085” and 0.093”.
7.2Heatsink Performance
Figure 7-1depicts the measured thermal performance of the 2nd NB reference thermal solution versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory | 31 |
Bridge (XMB) Thermal/Mechanical Design Guide | |
