Intel E8500 manual XMB Package Dimensions Top View

Packaging Technology

Figure 2-4. XMB Package Dimensions (Top View)

Handling
Exclusion		14.02mm.
Area		8.88mm.
11.73mm.	6.65mm.	XMB
		Die

Die

Keepout

Area

23.50mm. 27.50mm. 37.50mm.

23.50mm.

27.50mm.

37.50mm.

Figure 2-5. XMB Package Dimensions (Side View)

Substrate	Decoup
2.535 ± 0.123 mm			Die
	Cap
2.100 ± 0.121 mm		0.84 ± 0.05 mm
			0.7 mm Max	0.20 See Note 4
			Seating Plane	0.20 –C–
0.435 ± 0.025 mm
				See Note 1
See Note 3
Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

Intel® 8500 Chipset North Bridge (NB) and eXternal Memory	13
Bridge (XMB) Thermal/Mechanical Design Guide