Thermal Metrology
Figure 5-1. Thermal Solution Decision Flowchart
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Figure 5-2. Zero Degree Angle Attach Heatsink Modifications
NOTE: Not to scale.
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)
Thermocouple Wire 
Die
Substrate
Cement + Thermocouple Bead
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NOTE: Not to scale.
20 | Intel® E8500 Chipset North Bridge (NB) and eXternal Memory |
| Bridge (XMB) Thermal/Mechanical Design Guide |
