Intel E8500 manual Thermal Simulation

4Thermal Simulation

Intel provides thermal simulation models of the E8500 chipset NB/XMB components and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in ICEPAK* format. Contact your Intel field sales representative to order the thermal models and user's guides.

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Intel® E8500 Chipset North Bridge (NB) and eXternal Memory	17
Bridge (XMB) Thermal/Mechanical Design Guide