Intel manual Intel E8500 Chipset XMB Thermal Specifications

Thermal Specifications

Table 3-2. Intel® E8500 Chipset XMB Thermal Specifications

Parameter	Value	Notes
Tcase_max	105°C
Tcase_min	5°C
TDPdual channel	9.1W	DDR-266
TDPdual channel	9.3W	DDR-333
TDPdual channel	8.5W	DDR2-400

NOTE:

1.These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

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16	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide