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E8500
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Thermal Simulation
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E8500
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Specification
Second NB Heatsink Assembly
Power Simulation Software
XMB Reference Thermal Solution
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Thermal Simulation
18
Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
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Page 19
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Contents
Thermal/Mechanical Design Guide
Intel E8500 Chipset North Bridge NB and eXternal Memory
Contents
Figures
Tables
Revision History
Introduction
Design Flow
Definition of Terms
BGA
Reference Documents
XMB
Introduction
Packaging Technology
TNB
NB Package Dimensions Bottom View
XMB Package Dimensions Top View
XMB Package Dimensions Bottom View
Package Mechanical Requirements
Thermal Specifications
Thermal Design Power TDP
Die Case Temperature Specifications
Intel E8500 Chipset XMB Thermal Specifications
Thermal Simulation
Thermal Simulation
Die Case Temperature Measurements
Thermal Metrology
Thermal Solution Decision Flowchart
Power Simulation Software
Thermal Metrology
NB Reference Thermal Solution #1
Operating Environment
Heatsink Performance
Mechanical Design Envelope
Board-Level Components Keepout Dimensions
First NB Reference Heatsink Volumetric Envelope
First NB Heatsink Thermal Solution Assembly
TNBLocation
Extruded Heatsink Profiles
Heatsink Retaining Fastener
Reliability Guidelines
Reliability Guidelines
NB Reference Thermal Solution #1
NB Reference Thermal Solution #2
NB Reference Thermal Solution #2
Second NB Heatsink Thermal Solution Assembly
Second NB Reference Heatsink Volumetric Envelope
Second NB Heatsink Assembly
Please refer to .6 for detail
NB Reference Thermal Solution #2
XMB Reference Thermal Solution
XMB Heatsink Thermal Solution Assembly
XMB Reference Heatsink Volumetric Envelope
XMB Location
Extruded Heatsink Profiles
XMB Heatsink Extrusion Profile
XMB Reference Thermal Solution
Thermal Solution Component Suppliers
Table A-1 NB Heatsink Thermal Solution #1
Table A-2 NB Heatsink Thermal Solution #2
Table A-3 XMB Heatsink Thermal Solution
Thermal Solution Component Suppliers
Mechanical Drawings
Table B-1. Mechanical Drawing List
Figure B-1. NB Heatsink #1 Assembly Drawing
Figure B-2. NB Heatsink #1 Drawing
Figure B-3. NB Heatsink #2 Assembly Drawing
Figure B-4. NB Heatsink #2 Drawing
Figure B-5. XMB Heatsink Assembly Drawing
Figure B-6. XMB Heatsink Drawing
Intel E8500 Chipset North Bridge NB and eXternal Memory
