Intel E8500 manual Extruded Heatsink Profiles

XMB Reference Thermal Solution

8.5.2Extruded Heatsink Profiles

The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB. Figure 8-5shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. A full mechanical drawing of this heatsink is provided in Appendix B.

8.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

8.5.4Thermal Interface Material

A TIM provides improved conductivity between the die and the heatsink. The reference thermal solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm (0.7 in. x 0.7 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it reaches its phase change temperature.

8.5.4.1Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

8.5.5Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B for a mechanical drawing of the fastener.

40	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide