Tables
Intel® E8500 | Chipset NB Thermal Specifications | 15 | |
Intel® E8500 | Chipset XMB Thermal Specifications | 16 | |
Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure | 28 | ||
Reliability Guidelines | 29 | ||
NB Heatsink Thermal Solution #1 | 43 | ||
NB Heatsink Thermal Solution #2 | 44 | ||
XMB Heatsink Thermal Solution | 44 | ||
Mechanical Drawing List | 47 |
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory | 5 |
Bridge (XMB) Thermal/Mechanical Design Guide |
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