NB Reference Thermal Solution #1
6.5First NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.
Figure 6-3. First NB Heatsink Board Component Keepout
4X Ø 5.5mm
64.500mm. |
55.245mm. |
42.500mm. |
TNBLocation |
42.500mm. 55.245mm. 64.500mm.
4X Ø 2.95 ± 0.0254mm
No Component Keep Out Area
4.14mm Max Component Height
Heatsink Mounting Hole
NOTE: All dimensions are in millimeters.
26 | Intel® E8500 Chipset North Bridge (NB) and eXternal Memory |
| Bridge (XMB) Thermal/Mechanical Design Guide |
