Intel E8500 manual Second NB Heatsink Thermal Solution Assembly

NB Reference Thermal Solution #2

Figure 7-2. Second NB Reference Heatsink Volumetric Envelope

H e a ts in k						m .
F in						m
						5 5 .0 9
				.	m .
				m	m
				m	9
				4	.2
					4
H e a ts in k		B a s e
IH S + T IM 2
F C B G A
M o th e r b o a rd
6 4 .5 2	m m .
4 2 .5 0	m m .
H e a ts in k		B a s e
				m m .
			.	64 .5 2
H e a ts in k			m
			.5 0 m
F in
			4 0

7.4Board-Level Components Keepout Dimensions

Please refer to Section 6.4 for detail.

7.5Second NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory	33
Bridge (XMB) Thermal/Mechanical Design Guide