AThermal Solution Component Suppliers
Table | NB Heatsink Thermal Solution #1 |
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| Part | Intel Part Number |
| Supplier | Contact Information |
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Heatsink Assembly includes: |
| CCI/ACK | Harry Lin (USA) | |||
• | Unidirectional Fin Heatsink |
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• | Thermal Interface Material |
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| hlinack@aol.com | |
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• | Retaining Fastener |
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| Monica Chih (Taiwan) | |
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| monica_chih@ccic.com.tw |
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Unidirectional Fin Heatsink |
| CCI/ACK | Harry Lin (USA) | |||
(64.52 x 64.52 x 50.8 mm) |
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| hlinack@aol.com |
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| Monica Chih (Taiwan) |
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| monica_chih@ccic.com.tw |
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Thermal Interface |
| Chomerics | Todd Sousa (USA) | |||
(T710) |
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| tsousa@parker.com |
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Retaining Fastener | - |
| ITW Fastex* | Ron Schmidt (USA) | ||
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| rschmidt@itwfastex.com |
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| Henry Lu (Taiwan) |
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| (886) |
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| henry@mail.itwasia.com.tw |
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Intel® E8500 Chipset North Bridge (NB) and eXternal Memory | 43 |
Bridge (XMB) Thermal/Mechanical Design Guide |
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