NB Reference Thermal Solution #2
Figure 7-3. Second NB Heatsink Assembly
7.5.1Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.
7.5.2Extruded Heatsink Profiles
Please refer to Section 6.5.2 for detail.
7.5.3Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
7.5.4Thermal Interface Material
Please refer to Section 6.5.4 for detail.
7.5.4.1Effect of Pressure on TIM Performance
Please refer to Section 6.5.4.1 for detail.
7.5.5Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.
34 | Intel® E8500 Chipset North Bridge (NB) and eXternal Memory |
| Bridge (XMB) Thermal/Mechanical Design Guide |
