XMB Reference Thermal Solution
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.
Figure 8-3. XMB Heatsink Board Component Keepout
4X Ø 5.5mm
63.500mm. |
|
55.250mm. |
|
37.500mm. |
|
37.5mm |
|
XMB Location | 38.097mm. 48.260mm. |
4X Ø 2.95 ± 0.0254mm
No Component Keep Out Area
2.48mm Max Component Height
Heatsink Mounting Hole
8.5.1Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.
Figure 8-4. XMB Heatsink Assembly
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory | 39 |
Bridge (XMB) Thermal/Mechanical Design Guide |
|
