Intel E8500 XMB Heatsink Thermal Solution Assembly, XMB Reference Heatsink Volumetric Envelope

XMB Reference Thermal Solution

8.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width and depth constraints typically placed on the E8500 chipset XMB thermal solution are showing in Figure 8-2.

When using heatsinks that extend beyond the XMB reference heatsink envelope shown in Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot exceed 2.48 mm (0.10 in.) in height.

Figure 8-2. XMB Reference Heatsink Volumetric Envelope

		Heatsink Fin	4.5 mm.	2.60 mm.	26.60 mm.
		Heatsink Base
	Die + TIM
FCBGA + Solder Balls		Motherboard
		63.50mm.
	mm.	Heatsink Fin	mm.
	30.26		48.26
		45.50mm.

8.4Board-Level Components Keepout Dimensions

The locations of holes pattern and keepout zones for the reference thermal solution are shown in Figure 8-3.

8.5XMB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset XMB component is a passive extruded heatsink with thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4shows the reference thermal solution assembly and associated components.

38	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide