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Intel E8500 manual Thermal Metrology

Models: E8500

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Specs Second NB Heatsink Assembly Power Simulation Software XMB Reference Thermal Solution

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Thermal Metrology

22	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8500 manual Thermal Metrology

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Contents

Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Introduction Design Flow Definition of Terms BGA Reference Documents XMB Introduction Packaging Technology TNB NB Package Dimensions Bottom View XMB Package Dimensions Top View XMB Package Dimensions Bottom View Package Mechanical Requirements Thermal Design Power TDP Thermal SpecificationsDie Case Temperature Specifications Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Die Case Temperature Measurements Thermal Metrology Thermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Operating Environment NB Reference Thermal Solution #1Heatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions First NB Reference Heatsink Volumetric Envelope First NB Heatsink Thermal Solution Assembly TNBLocation Extruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability Guidelines NB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Heatsink Thermal Solution Assembly Second NB Reference Heatsink Volumetric Envelope Second NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Heatsink Thermal Solution Assembly XMB Reference Heatsink Volumetric Envelope XMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Thermal Solution Component Suppliers Table A-1 NB Heatsink Thermal Solution #1 Table A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Mechanical Drawings Table B-1. Mechanical Drawing List Figure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory

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