Intel E8500 manual Package Mechanical Requirements, XMB Package Dimensions Bottom View

Packaging Technology

Figure 2-6. XMB Package Dimensions (Bottom View)

AV A

U

AT A

R

AP A

AM N

AL

AK

A AJ

H AG

AF

A AE

D A

AB C

AA

Y

W

V 42.5 + 0.0

U

		T
		R
		P
		N
		M
		L
20.202		K
		J
		H
		G
		F
		E
	37X 1.092	D
		C
		B
		A

1	2	3	4	5	6	7	8	9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
									A

37X 1.092

20.202

42.5 + 0.05		B
0.2	C	A

2.1Package Mechanical Requirements

The E8500 chipset NB package has an IHS and the XMB package has an exposed bare die which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Notes:

1.The heatsink attach solutions must not include continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2.These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/IHS top surface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only

	§
14	Intel® 8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide