Intel E8500 manual Board-Level Components Keepout Dimensions

NB Reference Thermal Solution #1

Figure 6-2. First NB Reference Heatsink Volumetric Envelope

H e a ts in k				m.
F in				m
				55 .0 9
			.
		m m .	9 m m
		4	.2
			4
H eatsin k B ase
IH S + T IM 2
F C B G A + S o ld er B alls
M o th e rb o a rd
64 .5 2 m m .
4 2 .5 0 m m .
T N B
H e a ts in k
H e a ts in k	m m .	m m .
	.5 0	.5 2
F in
	42	64
H eatsin k B ase

6.4Board-Level Components Keepout Dimensions

The location of hole pattern and keepout zones for the reference thermal solution are shown in Figure 6-3.

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory	25
Bridge (XMB) Thermal/Mechanical Design Guide