Intel MPCBL0001 manual Level a Materials and Substances, Level B Materials and Substances

Intel NetStructure® MPCBL0001 High Performance Single Board Computer Material Declaration Data Sheets

Material Declaration Data Sheet

Intel NetStructure® MPCBL0001 Single Board Compute	Product Weight (grams):	2281.9
MPCBL0001N04Q	Manufacturer:	Intel Corporation
Pb Free Product: Yes	Revision Date:	5/31/2006

Restrictions on Hazardous Substances (RoHS) Compliance

RoHS Definition

*Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE)

*Quantity limit of 0.01% by mass (100 PPM) of homogeneous material for: Cadmium

Intel understands RoHS requires: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance

thresholds as defined by the EU or (2) an approved exemption applies. (Note: RoHS implementation details are not fully defined and may change.)

RoHS Declaration

*The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following exemption: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

*The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following exemption: Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications. The applicability of this exemption depends on use of the part in one of the listed exempt applications.

*The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following exemption: Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

*The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following exemption: Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead).

*The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following exemption: Lead in electronic ceramic parts (e.g. piezoelectronic devices).

*The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following exemption: Lead used in compliant pin connector systems.

*The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following exemption: Lead as a coating material for a thermal conduction module c-ring.

Where the part is declared to meet RoHS requirements, it has been verified to be in conformance with 2002/95/EC as we currently understand the requirements. Intel has systems in place to verify conformance with all applicable environmental requirements and to the best of our knowledge the information is true and correct.

LEVEL A MATERIALS AND SUBSTANCES

Materials from Annex A of the EIA/EICTA/JGPSSI Material Composition Declaration Guide and listed in the table below are not contained in this product in quantities above the threshold level for these materials as stated in the EIA/EICTA/JGPSSI Material Composition Declaration Guide, nor intentionally added to this product.

Asbestos	Mercury / Mercury Compounds	Polychlorinated Naphthalenes
Azo colorants	Ozone Depleting Substances	Radioactive Substances
Cadmium / Cadmium Compounds	Polybrominated Biphenyls (PBBs)	Shortchain Chlorinated Paraffins
Hexavalent Chromium	Polybrominated Diphenylethers (PBDEs)	Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Hexavalent Chromium Compounds	Polychlorinated Biphenyls (PCBs)	Tributyl Tin Oxide (TBTO)

If this product contains lead (Pb) above the threshold limit of 1000 ppm, the concentration, location and use for this product are listed below.

	Description of Use	Location in Product	Material Concentration
			(ppm)
Lead/Lead Compounds

LEVEL B MATERIALS AND SUBSTANCES

Antimony/Antimony Compounds	Bismuth/Bismuth Compounds	Phthalates
Arsenic/Arsenic Compounds	Brominated Flame Retardants	Selenium/Selenium Compounds
Beryllium/Beryllium Compounds	Nickel/Nickel Compounds	Vinyl Chloride Polymer (PVC)

Technical Product Specification	195
Order #273817