Intel MPCBL0001 manual Board Layer Specifications, Weight, Cooling Requirements

Intel NetStructure® MPCBL0001 High Performance Single Board Computer

Contents

6.3.3Cooling Requirements

The Intel NetStructure® MPCBL0001 High Performance Single Board Computer SBC should be installed vertically in a chassis, with bottom-to-top airflow. Airflow is expected to be evenly distributed across the bottom edge of the installed MPCBL0001 blade and maintain at least 300 LFM average airflow.

Most components on the MPCBL0001 blade are specified to operate with a localized ambient temperature up to 70° C and do not require heat sinks. The MPCBL0001 blade uses two custom heat sinks, one per processor (see Figure 26, “Low Voltage Intel® Xeon™ Processor Heatsink” on page 109.) The rate of airflow specified above is critical to ensuring that the blade operates as designed.

Figure 26. Low Voltage Intel® Xeon™ Processor Heatsink

B0903-01

6.4Board Layer Specifications

Material: TG180 FR4

Layers: 14

Copper:

•Outer layers 1 and 14 are 1 oz copper

•Middle planes 7 & 8 are 2 oz copper

•All others are 1 oz copper.

6.5Weight

The weight of the baseboard (N04 and F04) is 3.0645 kg (6.75 lbs.) without any packaging materials.

Technical Product Specification	109
Order #273817