NEC user manual Differences Between μPD75P308 and μPD75308, Eprom

μPD75P308

2. DIFFERENCES BETWEEN μPD75P308 AND μPD75308

The μPD75P308 is a model of the μPD75308 and is equipped with a PROM instead of a mask ROM. Programs can be rewritten to the PROM of the μPD75P308. Table 2-1 shows the differences between the μPD75P308 and μPD75308. You should fully consider these differences when you debug or produce your application system on an experimental basis by using the PROM model, and then proceed to mass-produce the system by using the mask ROM model.

For the details of the CPU and the internal hardware, refer to μPD75308 User's Manual (IEM-5016).

Table 2-1 Differences between μPD75P308 and μPD75308

	Item		μPD75P308K			μPD75P308GF	μPD75308GF
			• EPROM			• PROM (one-time model)	• Mask ROM
	Program Memory		• 0000H-1F7FH			• 0000H-1F7FH	• 0000H-1F7FH
			• 8064 x 8 bits			• 8064 x 8 bits	• 8064 x 8 bits
	Pull-up Resistor	Ports 4, 5		Not provided			Mask option
	Dividing Resistor for LCD			Not provided			Mask option
	Driving Power Supply
	Pin Connection	Pins 50-53	P30/MD0-P33/MD3				P30-P33
		Pin 57			VPP		NC
	Electrical Specifications		Current dissipations and operating temperature ranges differ between μPD75P308 and
			μPD75308. For detail, refer to the specification documents of each mode.
★
	Operating Voltage Range				5V±5%		2.7-6.0V
	Package		80-pin ceramic WQFN			80-pin plastic QFP (14 x 20 mm)
			(LCC w/window)
	Others		Noise immunity and noise radiation differ because circuit scale and mask layout are
★			different.

★Note: The noise immunity and noise radiation differ between the PROM and mask ROM models. To replace the PROM model with the mask ROM model in the course of experimental production to mass production, evaluate your system by using the CS mode (not ES model) of the mask ROM model.

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