NEC Recommended Soldering Conditions, ΜPD75P308GF-3B9 80-pin plastic QFP 14 x 20 mm, Vps

μPD75P308

★6. RECOMMENDED SOLDERING CONDITIONS

It is recommended that μPD75P308 be soldered under the following conditions.

For details on the recommended soldering conditions, refer to Information Document "Semiconductor Devices Mounting Manual" (IEI-616).

The soldering methods and conditions are not listed here, consult NEC.

Table 6-1 Soldering Conditions

μPD75P308GF-3B9: 80-pin plastic QFP (14 x 20 mm)

Soldering Method	Soldering Conditions	Symbol for Recommended
		Condition
Wave Soldering	Soldering bath temperature: 260°C max.,	WS60-162-1
	time: 10 seconds max., number of times: 1,
	pre-heating temperature: 120°C max. (package surface
	temperature), maximum number of days: 2 days*,
	(beyond this period, 16 hours of pre-baking is required
	at 125°C).
Infrared Reflow	Package peak temperature: 230°C,	IR30-162-1
	time: 30 seconds max. (210°C min.),
	number of times: 1, maximum number of days: 2 days*
	(beyond this period, 16 hours of pre-baking is required
	at 125°C)
VPS	Package peak temperature: 215°C,	VP15-162-1
	time: 40 seconds max. (200°C min.),
	number of times: 1, maximum number of days: 2 days*
	(beyond this period, 16 hours of pre-baking is required
	at 125°C)
Pin Partial Heating	Pin temperature: 300°C max.,	—
	time: 3 seconds max. (per side)

*: Number of days after unpacking the dry pack. Storage conditions are 25°C and 65%RH max.

Caution: Do not use two or more soldering methods in combination (except the pin partial heating method).

Notice

A model that can be soldered under the more stringent conditions (infrared reflow peak temperature: 235°C, number of times: 2, and an extended number of days) is also available.

For details, consult NEC.

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