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Peripheral Architecture
2.12 VTP IO Buffer Calibration
The DDR2 memory controller is able to control the impedance of the output IO. This feature allows the DDR2 memory controller to tune the output impedance of the IO to match that of the PCB board. Control of the output impedance of the IO is an important feature because impedance matching reduces reflections, creating a cleaner board design. Calibrating the output impedance of the IO will also reduce the power consumption of the DDR2 memory controller. The calibration is performed with respect to voltage, temperature, and process (VTP). The VTP information obtained from the calibration is used to control the output impedance of the IO.
The impedance of the output IO is selected by the value of resistors connected to the DDR_ZN and DDR_ZP pins. The resistor should be chosen to be 4 times the desired impedance of the output IO. The DDR2 reference design requires the resistor values to be 200 ohms. This means that both the DDR_ZN and DDR_ZP pins must have a 200 ohm resistor connected to them. Figure 3 describes proper connection of the DDR_ZN and DDR_ZP pins.
To set the output impedance of the IO, calibration must be initiated by writing to the following
∙VTP IO Control Register (VTPIOCR)
∙DDR VTP Register (DDRVTPR)
∙DDR VTP Enable Register (DDRVTPER)
The VTP IO control register is written to begin the calibration. Once the calibration is complete, the VTP information is stored in the DDR VTP register. The DDR VTP register should then be read, retrieving the VTP information, and the VTP information written to the VTP IO control register. The DDR VTP enable register is written to enable/disable access to the DDR VTP register. Steps
Note: VTP IO calibration must be performed following device power up and device reset. If the DDR2 memory controller is reset via the Power and Sleep Controller (PSC) and the VTP input clock is disabled, accesses to the DDR2 memory controller will not complete. To
2.13 Auto-Initialization Sequence
The DDR2 SDRAM contains mode and extended mode registers that configure the DDR2 memory for operation. These registers control burst type, burst length, CAS latency, DLL enable/disable (on the DDR2 device),
∙Following reset (rising edge of VRST or VCTL_RST)
∙Following a write to the DDRDRIVE bit field or the two
During the initialization sequence, the DDR2 memory controller issues MRS and EMRS commands that configure the DDR2 SDRAM mode register and extended mode register 1 with the values described in Table 14 and Table 15. The DDR2 SDRAM extended mode registers 2 and 3 are configured with a value of 0h. At the end of the initialization sequence, the DDR2 memory controller performs an autorefresh cycle, leaving the DDR2 memory controller in an idle state with all banks deactivated.
When a reset occurs, the DDR2 memory controller immediately begins the initialization sequence. Under this condition, commands and data stored in the DDR2 memory controller FIFOs will be lost. However, when the initialization sequence is initiated by a write to the two
DDR2 Memory Controller | 31 |