PRELIMINARY CY8CNP102B, CY8CNP102E
Packaging Information
This section describes the packaging specifications for the PSoC NV device and the thermal impedances for TQFP package.
Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation tool dimensions, refer to the document “PSoC Emulator Pod Dimensions” at http://www.cypress.com/design/MR10161.
Package Diagrams
Figure 15. 100-Pin TQFP - 14 x 14 x 1.4 mm
Thermal Impedance
Table 41. Thermal Impedance |
|
|
|
|
|
Package[10] | Typical θJA * | Typical θJC * |
100 TQFP | 26.14 oC/W | 5.81 oC/W |
Note
10. * TJ = TA + POWER x θJA
Document #: | Page 36 of 38 |
[+] Feedback