Cypress CY8CNP102B, CY8CNP102E PSoC NV Functional Overview, PSoC NV Core, NvSRAM Data Memory, Nvc

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PRELIMINARY CY8CNP102B, CY8CNP102E

Table 1. Pin Definitions - 100-Pin TQFP (continued)

Pin Number

Pin Name

 

Type

Pin Definition

Digital

 

Analog

 

 

 

 

79

HSB#

 

 

 

Weak Pull up. Connect 10kΩ to Vcc.

 

 

 

 

 

80

Vcc

 

Power

Supply Voltage

 

 

 

 

 

 

81 - 85

NC

 

 

 

Not connected on the die

86 - 90

Vss

 

Power

Ground

 

 

 

 

 

 

91 - 98

NC

 

 

 

Not connected on the die

99

NV_C

 

 

 

Connect to Pin 61 (NV_C to EN_C).Weak Pull up. Connect 10kΩ to Vcc.

 

 

 

 

 

 

100

P0_7

IO

 

I

Analog Column Mux Input, GPIO

 

 

 

 

 

 

PSoC NV Functional Overview

The PSoC NV provides a versatile microcontroller core (M8C), Flash program memory, nvSRAM data memory, and configurable analog and digital peripheral blocks in a single package. The flexible digital and analog IOs and routing matrix create a powerful embedded and flexible mixed signal System-on-Chip (SoC).

The device incorporates configurable analog and digital blocks, interconnect circuitry around an MCU subsystem, and an infinite endurance nvSRAM. This enables high level integration in consumer, industrial, and automotive applications, where preventing data loss under all conditions is vital.

PSoC NV Core

The PSoC NV core is a powerful PSoC engine that supports a rich feature set. The core includes a M8C CPU, memory, clocks, and configurable GPIO (General Purpose IO). The M8C CPU core is a powerful processor with speeds up to 24 MHz, providing

afour MIPS 8-bit Harvard architecture microprocessor. The CPU uses an interrupt controller with 25 vectors, to simplify programming of real time embedded events. Program execution is timed and protected using the included Sleep and Watch Dog Timers (WDT).

On-chip memory encompasses 32 KB Flash for program storage, 2 KB SRAM for data storage, 256 KB nvSRAM for data logging, and up to 2 KB EEPROM emulated using Flash. Program Flash uses four protection levels on blocks of 64 bytes, allowing customized software IP protection. The nvSRAM combines a static RAM cell and a SONOS cell to provide an infinite endurance nonvolatile memory block. The memory is random access and is accessed using a user module provided with the device.

The device incorporates flexible internal clock generators, including a 24 MHz Internal Main Oscillator (IMO) accurate to 2.5 percent over temperature and voltage. The 24 MHz IMO can also be doubled to 48 MHz for use by the digital system. A low power 32 kHz Internal Low speed Oscillator (ILO) is provided for the Sleep timer and WDT. The clocks, together with programmable clock dividers (as a System Resource), provide the flexibility to integrate almost any timing requirement into the PSoC NV device.

GPIOs provide connection to the CPU, and digital and analog resources of the device. Each pin’s drive mode may be selected from eight options, allowing great flexibility in external

interfacing. Every pin also has the capability to generate a system interrupt on high level, low level, and change from last read.

nvSRAM Data Memory

The nvSRAM memory block is byte addressable fast static RAM with a nonvolatile element in each memory cell. The embedded nonvolatile elements incorporate QuantumTrap® technology producing the world’s most reliable nonvolatile memory. The SRAM provides infinite read and write cycles, when independent nonvolatile data resides in the highly reliable QuantumTrap cell. Data transfers from the SRAM to the nonvolatile elements (the STORE operation) takes place automatically at power down, and data is restored to the SRAM (the RECALL operation) from the nonvolatile memory on power up. All cells store and recall data in parallel.

Both the STORE and RECALL operations may be initiated under software control. The PSoC NV user module embedded in the PSoC Designer Tool provides all necessary APIs to initiate software STORE and RECALL function from the user program.

nvSRAM Operation

The nvSRAM is made up of an SRAM memory cell, and a nonvolatile QuantumTrap cell paired in the same physical cell. The SRAM memory cell operates as a standard fast static, and all READ and WRITE takes place from the SRAM during normal operation.

During the STORE and RECALL operations, SRAM READ and WRITE operations are inhibited, and internal operations transfer data between the SRAM and nonvolatile cells. The nvSRAM provides infinite RECALL operations from the nonvolatile cells and up to 200,000 STORE operations.

To reduce unnecessary nonvolatile stores, AutoStore® is ignored unless at least one WRITE operation is complete after the most recent STORE or RECALL cycle. Software initiated STORE cycles are performed regardless of whether a WRITE operation has taken place. Embedded APIs provide a seamless interface to the nvSRAM.

During normal operation, the embedded nvSRAM draws current from Vcc to charge a capacitor connected to the VCAP pin. This stored charge is used by the chip to perform a STORE operation. If the voltage on the Vcc pin drops below VSWITCH, the part automatically disconnects the VCAP pin from Vcc and STORE operation is initiated.

Document #: 001-43991 Rev. *D

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Contents Overview FeaturesLogic Block Diagram ENW PinoutsGpio NVA1 NVWNVA2 ENA1PSoC NV Core PSoC NV Functional OverviewNvSRAM Data Memory NvSRAM OperationAdditional System Resources Programmable Digital SystemProgrammable Analog System Esigner Development ToolsPSoC Designer Software Subsystems User Module and Source Code Development Flows Designing with User ModulesHardware Tools Parts per million Cypress nvSRAM user ModuleMicrohenry Picosecond Microsecond Samples per second3V Operation Operating TemperatureAbsolute Maximum Ratings ESDDC Electrical Characteristics Psrroa CmrroaPsrr OB Capacitor Unit Value Switch Cap DC Analog Reference SpecificationsAgnd = BandGap1 Agnd = 1.6 x BandGap1 Resistor Unit Value Continuous TimePORLEV10 = 00b Vdd Value for Ppor Trip negative ramp Vdd Value for Ppor Trip positive rampPORLEV10 = 00b Ppor Hysteresis PORLEV10 = 00bInput Low Voltage During Programming or Verify Supply Current During Programming or VerifyDriving internal pull During Programming or Verify Down resistorDC24M AC Electrical CharacteristicsGpio Operating Frequency 12.3 MHz Normal Strong Mode TRiseS Power Up Recall DurationStore Cycle Duration 12.5 Low Voltage Trigger LevelBwoa Spim CrcprsSpis BwobData Out Delay from Falling Edge of Sclk 0V ≤ Vcc ≤ Data Set up Time to Falling Edge of SclkSetup Time for a Repeated Start Condition Data Hold Time Data Setup Time5V Operation High Output Level Vcc Capacitive Load on Pins as Input Pin dependent. Temp = 25oCCombined IOH budget Input Low Level 75 toGross tested to 1 μA Input Capacitance Port 0 Analog Pins Input Leakage Current Port 0 Analog PinsLow power comparator LPC reference voltage range Vcc Average Input Offset Voltage DriftPsrrob PORLEV10 = 10b Ppor Hysteresis PORLEV10 = 10b Vdd Value for Ppor Trip negative rampVM20 = 011b VM20 = 100bBlock Output Low Voltage During Programming orVerify MHz Trimmed for 5V operation Using factory trim valuesSee on Internal Main Oscillator Frequency for 6 MHzGpio Operating Frequency MHz Normal Strong Mode TRiseFVcc = 4.75V to TFallFMaximum Frequency 49.2 MHz 75V ≤ Vcc ≤ MHz due to 2 Over clocking Maximum Input Clock Frequency 24.6 MHz 75V ≤ Vcc ≤ CRC ModeSions Transmitter Maximum Input Clock Frequency 24.6 MHz Vcc ≥ 4.75V, 2 Stop Bits MHz due to 8 Over clocking 49.2Data Out Delay from Falling Edge of Sclk 75V ≤ Vcc ≤ A b l e Switching WaveformsL e c t External Crystal Oscillator Startup Timing DiagramOrdering Information Part Numbering NomenclatureCY8CNP102B-AXI CY8CNP102E-AXIThermal Impedance Package DiagramsTqfp 81 oC/WGVCH/PYRS Document HistoryPyrs USB Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions