Samsung M391B5773DH0, M391B5273DH0 Single-ended Requirements for Differential Signals, Time

Page 17

Unbuffered DIMM

datasheet

Rev. 1.0

DDR3L SDRAM

11.3.3 Single-ended Requirements for Differential Signals

Each individual component of a differential signal (CK, DQS, CK, DQS) has also to comply with certain requirements for single-ended signals.

CK and CK have to approximately reach VSEHmin / VSELmax (approximately equal to the ac-levels ( VIH(AC) / VIL(AC) ) for ADD/CMD signals) in every half-cycle.

DQS, DQS have to reach VSEHmin / VSELmax (approximately the ac-levels ( VIH(AC) / VIL(AC) ) for DQ signals) in every half-cycle proceeding and follow- ing a valid transition.

Note that the applicable ac-levels for ADD/CMD and DQ’s might be different per speed-bin etc. E.g. if VIH150(AC)/VIL150(AC) is used for ADD/CMD

signals, then these ac-levels apply also for the single-ended signals CK and CK .

VDD or VDDQ

VSEH min

VSEH

VDD/2 or VDDQ/2

VSEL max

VSS or VSSQ

CK or DQS

VSEL

time

Figure 4. Single-ended requirement for differential signals

Note that while ADD/CMD and DQ signal requirements are with respect to VREF, the single-ended components of differential signals have a requirement with respect to VDD/2; this is nominally the same. The transition of single-ended signals through the ac-levels is used to measure setup time. For single- ended components of differential signals the requirement to reach VSELmax, VSEHmin has no bearing on timing, but adds a restriction on the common mode characteristics of these signals.

[ Table 6 ] Single ended levels for CK, DQS, CK, DQS

Symbol

Parameter

 

DDR3-800/1066/1333/1600

Unit

NOTE

 

Min

Max

 

 

 

 

 

 

 

 

VSEH

Single-ended high-level for strobes

 

(VDD/2)+0.175

NOTE 3

V

1, 2

 

 

 

 

 

(VDD/2)+0.175

 

 

 

Single-ended high-level for CK, CK

 

NOTE 3

V

1, 2

 

 

VSEL

Single-ended low-level for strobes

 

NOTE 3

(VDD/2)-0.175

V

1, 2

 

 

 

 

 

 

(VDD/2)-0.175

 

 

Single-ended low-level for CK, CK

 

NOTE 3

V

1, 2

 

 

NOTE :

1.For CK, CK use VIH/VIL(AC) of ADD/CMD; for strobes (DQS, DQS) use VIH/VIL(AC) of DQs.

2.VIH(AC)/VIL(AC) for DQs is based on VREFDQ; VIH(AC)/VIL(AC) for ADD/CMD is based on VREFCA; if a reduced ac-high or ac-low level is used for a signal group, then the reduced level applies also here

3.These values are not defined, however the single-ended signals CK, CK, DQS, DQS need to be within the respective limits (VIH(DC) max, VIL(DC)min) for single-ended sig- nals as well as the limitations for overshoot and undershoot. Refer to "Overshoot and Undershoot Specification"

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Image 17 Contents
Datasheet History Draft Date RevTable Of Contents Address Configuration Key FeaturesDDR3L Unbuffered Dimm Ordering Information Speed DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 UnitPin Front Back X72 Dimm Pin Configurations Front side/Back sidePin Name Description Pin DescriptionSPD and Thermal Sensor for ECC UDIMMs Input/Output Functional Description Symbol Type FunctionConnector Pin Dram Pin Rank Address Mirroring FeatureDram Pin Wiring Mirroring SCL SDA Event SA0 SA1 SA2 Function Block DiagramD14 Absolute Maximum Ratings Dram Component Operating Temperature RangeAC & DC Operating Conditions Absolute Maximum DC RatingsAC & DC Input Measurement Levels 11.1 AC & DC Logic Input Levels for Single-ended SignalsVIH.DQDC90 Illustration of Vrefdc tolerance and Vref ac-noise limits Vref Tolerances35V AC and DC Logic Input Levels for Differential SignalsDifferential Signals Definition TBD Time Single-ended Requirements for Differential SignalsCK, DQS Vsel Differential Input Cross Point VoltageSlew rate definition for Differential Input Signals Slew Rate Definition for Single Ended Input SignalsAC & DC Output Measurement Levels Single Ended AC and DC Output LevelsSRQse Single-ended Output Slew RateDifferential output slew rate definition Differential Output Slew RateSymbol Description IDD specification definitionDatasheet IDD Spec Table DDR3-1066 DDR3-1333 DDR3-1600 Symbol 11-11-11 UnitM391B5773DH0 2GB256Mx72 Module M391B5273DH0 4GB512Mx72 ModuleCZQ Input/Output CapacitanceRefresh Parameters by Device Density Electrical Characteristics and AC timingDDR3-1066 Speed Bins DDR3-1600 Speed Bins CL-nRCD-nRP Speed Bin Table NotesDatasheet Timing Parameters by Speed Bin Timing Parameters by Speed GradeMIN MAX Reset Timing Jitter Notes ZQCorrection TSens x Tdriftrate + VSens x Vdriftrate Timing Parameter Notes18.1 256Mbx8 based 256Mx72 Module 1 Rank M391B5773DH0 Physical Dimensions18.2 256Mbx8 based 512Mx72 Module 2 Ranks M391B5273DH0
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