Samsung M391B5773DH0, M391B5273DH0 Absolute Maximum Ratings, AC & DC Operating Conditions

Page 11

Unbuffered DIMM

datasheet

Rev. 1.0

DDR3L SDRAM

9. Absolute Maximum Ratings

9.1 Absolute Maximum DC Ratings

Symbol

Parameter

Rating

Units

NOTE

VDD

Voltage on VDD pin relative to VSS

-0.4 V ~ 1.975 V

V

1,3

VDDQ

Voltage on VDDQ pin relative to VSS

-0.4 V ~ 1.975 V

V

1,3

VIN, VOUT

Voltage on any pin relative to VSS

-0.4 V ~ 1.975 V

V

1

TSTG

Storage Temperature

-55 to +100

°C

1, 2

NOTE :

1.Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

2.Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard.

3.VDD and VDDQ must be within 300mV of each other at all times;and VREF must be not greater than 0.6 x VDDQ, When VDD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV.

9.2 DRAM Component Operating Temperature Range

Symbol

Parameter

rating

Unit

NOTE

TOPER

Operating Temperature Range

0 to 95

°C

1, 2, 3

NOTE :

1.Operating Temperature TOPER is the case surface temperature on the center/top side of the DRAM. For measurement conditions, please refer to the JEDEC document JESD51-2.

2.The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case temperature must be main- tained between 0-85°C under all operating conditions

3.Some applications require operation of the Extended Temperature Range between 85°C and 95°C case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply:

a)Refresh commands must be doubled in frequency, therefore reducing the refresh interval tREFI to 3.9us. It is also possible to specify a component with 1X refresh (tREFI to 7.8us) in the Extended Temperature Range.

b)If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b), in this case IDD6 current can be increased around 10~20% than normal Temperature range.

10. AC & DC Operating Conditions

10.1 Recommended DC Operating Conditions (SSTL-15)

Symbol

Parameter

Operation Voltage

 

Rating

 

Units

NOTE

Min.

Typ.

Max.

 

 

 

 

 

VDD

Supply Voltage

1.35V

1.283

1.35

1.45

V

1, 2, 3

 

 

 

 

 

 

1.5V

1.425

1.5

1.575

V

1, 2, 3

 

 

 

 

 

 

 

 

 

 

VDDQ

Supply Voltage for Output

1.35V

1.283

1.35

1.45

V

1, 2, 3

 

 

 

 

 

 

1.5V

1.425

1.5

1.575

V

1, 2, 3

 

 

 

 

 

 

 

 

 

 

NOTE:

1.Under all conditions VDDQ must be less than or equal to VDD.

2.VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.

3.VDD & VDDQ rating are determinied by operation voltage.

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Contents
Datasheet History Draft Date RevTable Of Contents Speed DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 Unit Key FeaturesAddress Configuration DDR3L Unbuffered Dimm Ordering InformationPin Front Back X72 Dimm Pin Configurations Front side/Back sidePin Name Description Pin DescriptionSPD and Thermal Sensor for ECC UDIMMs Input/Output Functional Description Symbol Type FunctionConnector Pin Dram Pin Rank Address Mirroring FeatureDram Pin Wiring Mirroring SCL SDA Event SA0 SA1 SA2 Function Block DiagramD14 Absolute Maximum DC Ratings Dram Component Operating Temperature RangeAbsolute Maximum Ratings AC & DC Operating ConditionsAC & DC Input Measurement Levels 11.1 AC & DC Logic Input Levels for Single-ended SignalsVIH.DQDC90 Illustration of Vrefdc tolerance and Vref ac-noise limits Vref Tolerances35V AC and DC Logic Input Levels for Differential SignalsDifferential Signals Definition TBD Time Single-ended Requirements for Differential SignalsCK, DQS Vsel Differential Input Cross Point VoltageSingle Ended AC and DC Output Levels Slew Rate Definition for Single Ended Input SignalsSlew rate definition for Differential Input Signals AC & DC Output Measurement LevelsSRQse Single-ended Output Slew RateDifferential output slew rate definition Differential Output Slew RateSymbol Description IDD specification definitionDatasheet M391B5273DH0 4GB512Mx72 Module DDR3-1066 DDR3-1333 DDR3-1600 Symbol 11-11-11 UnitIDD Spec Table M391B5773DH0 2GB256Mx72 ModuleCZQ Input/Output CapacitanceRefresh Parameters by Device Density Electrical Characteristics and AC timingDDR3-1066 Speed Bins DDR3-1600 Speed Bins CL-nRCD-nRP Speed Bin Table NotesDatasheet Timing Parameters by Speed Bin Timing Parameters by Speed GradeMIN MAX Reset Timing Jitter Notes ZQCorrection TSens x Tdriftrate + VSens x Vdriftrate Timing Parameter Notes18.1 256Mbx8 based 256Mx72 Module 1 Rank M391B5773DH0 Physical Dimensions18.2 256Mbx8 based 512Mx72 Module 2 Ranks M391B5273DH0
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