Samsung M391B5773DH0, M391B5273DH0 Input/Output Functional Description, Symbol Type Function

Page 7

Unbuffered DIMM

datasheet

Rev. 1.0

DDR3L SDRAM

7. Input/Output Functional Description

 

 

 

 

Symbol

 

Type

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Function

 

 

 

 

 

 

 

 

 

 

 

 

 

CK and

 

 

are differential clock inputs. All the DDR3 SDRAM addr/cntl inputs are sampled on the crossing of positive

 

CK0-CK1

 

 

CK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SSTL

 

edge of CK and negative edge of CK. Output (read) data is reference to the crossing of CK and CK (Both directions of

 

 

 

 

 

 

 

 

 

 

 

 

 

CK0-CK1

 

 

 

 

crossing)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CKE0-CKE1

 

SSTL

 

Activates the SDRAM CK signal when high and deactivates the CK signal when low. By deactivating the clocks, CKE low

 

 

 

initiates the Power Down mode, or the Self-Refresh mode

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Enables the associated SDRAM command decoder when low and disables the command decoder when high. When the

 

S0-S1

 

SSTL

 

command decoder is disabled, new command are ignored but previous operations continue. This signal provides for

 

 

 

 

 

 

 

 

 

 

 

 

 

external rank selection on systems with multiple ranks.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SSTL

 

 

 

 

 

 

and

 

(ALONG WITH

 

 

 

 

 

 

 

 

 

 

 

 

RAS,

CAS,

WE

RAS,

CAS,

WE

S) define the command being entered.

 

 

 

 

 

 

 

 

 

 

 

 

 

When high, termination resistance is enabled for all DQ, DQS,

 

and DM pins, assuming the function is enabled in the

 

ODT0-ODT1

 

SSTL

 

DQS

 

 

 

Extended Mode Register Set (EMRS).

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VREFDQ

 

Supply

Reference voltage for SSTL 15 I/O inputs.

 

VREFCA

 

Supply

Reference voltage for SSTL 15 command/address inputs.

 

VDDQ

 

Supply

 

Power supply for the DDR3 SDRAM output buffers to provide improved noise immunity. For all current DDR3 unbuffered

 

 

 

DIMM designs, VDDQ shares the same power plane as VDD pins.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BA0-BA2

 

SSTL

Selects which SDRAM bank of eight is activated.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

During a Bank Activate command cycle, Address input defines the row address (RA0-RA13)

 

 

 

 

 

 

 

 

 

 

 

 

 

During a Read or Write command cycle, Address input defines the column address, In addition to the column address,

 

 

 

 

 

 

 

 

 

 

 

 

 

AP is used to invoke autoprecharge operation at the end of the burst read or write cycle. If AP is high, autoprecharge is

 

A0-A14

 

SSTL

 

selected and BA0, BA1, BA2 defines the bank to be precharged. If AP is low, autoprecharge is disabled. During a pre-

 

 

 

charge command cycle, AP is used in conjunction with BA0, BA1, BA2 to control which bank(s) to precharge. If AP is

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

high, all banks will be precharged regardless of the state of BA0, BA1 or BA2. If AP is low, BA0, BA1 and BA2 are used

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

is sampled during READ and WRITE commands to determine if burst chop

 

 

 

 

 

 

 

 

 

 

 

 

 

to define which bank to precharge. A12(BC)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(on-the-fly) will be performed (HIGH, no burst chop; Low, burst chopped).

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DQ0-DQ63

 

SSTL

Data and Check Bit Input/Output pins.

 

CB0-CB7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DM is an input mask signal for write data. Input data is masked when DM is sampled High coincident with that input data

 

DM0-DM81

 

SSTL

 

during a write access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches

 

 

 

 

 

 

 

 

 

 

 

 

 

the DQ and DQS loading.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDD,VSS

 

Supply

 

Power and ground for DDR3 SDRAM input buffers, and core logic. VDD and VDDQ pins are tied to VDD/VDDQ planes on

 

 

 

these modules.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DQS0-DQS81

 

SSTL

Data strobe for input and output data.

 

 

 

 

 

-

 

 

1

 

 

DQS0

DQS8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SA0-SA2

 

-

 

These signals and tied at the system planar to either VSS or VDDSPD to configure the serial SPD EERPOM address

 

 

 

range.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SDA

 

-

 

This bidirectional pin is used to transfer data into or out of the SPD EEPROM. An external resistor may be connected

 

 

 

from the SDA bus line to VDDSPD to act as a pull-up on the system board.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCL

 

-

 

This signal is used to clock data into and out of the SPD EEPROM. An external resistor may be connected from the SCL

 

 

 

bus time to VDDSPD to act as a pull-up on the system board.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDDSPD

 

Supply

 

Power supply for SPD EEPROM. This supply is separate from the VDD/VDDQ power plane. EEPROM supply is operable

 

 

 

from 3.0V to 3.6V.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

-

 

The

 

 

 

 

 

 

pin is connected to the

 

 

 

 

 

pin on each DRAM. When low, all DRAMs are set to a know state.

 

RESET

 

RESET

RESET

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

This signal indicates that a thermal event has been detected in the thermal sensing device. The system should guarantee

 

EVENT

 

Output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the electrical level requirement is met for the EVENT pin on TS/SPD part

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NOTE :

1. DM8, DQS8 and DQS8 are for ECC UDIMM only.

- 7 -

Image 7
Contents Datasheet History Draft Date RevTable Of Contents Speed DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 Unit Key FeaturesAddress Configuration DDR3L Unbuffered Dimm Ordering InformationPin Front Back X72 Dimm Pin Configurations Front side/Back sideSPD and Thermal Sensor for ECC UDIMMs Pin DescriptionPin Name Description Input/Output Functional Description Symbol Type FunctionDram Pin Wiring Mirroring Address Mirroring FeatureConnector Pin Dram Pin Rank SCL SDA Event SA0 SA1 SA2 Function Block DiagramD14 Absolute Maximum DC Ratings Dram Component Operating Temperature RangeAbsolute Maximum Ratings AC & DC Operating ConditionsAC & DC Input Measurement Levels 11.1 AC & DC Logic Input Levels for Single-ended SignalsVIH.DQDC90 Illustration of Vrefdc tolerance and Vref ac-noise limits Vref TolerancesDifferential Signals Definition AC and DC Logic Input Levels for Differential Signals35V TBD Time Single-ended Requirements for Differential SignalsCK, DQS Vsel Differential Input Cross Point VoltageSingle Ended AC and DC Output Levels Slew Rate Definition for Single Ended Input SignalsSlew rate definition for Differential Input Signals AC & DC Output Measurement LevelsSRQse Single-ended Output Slew RateDifferential output slew rate definition Differential Output Slew RateSymbol Description IDD specification definitionDatasheet M391B5273DH0 4GB512Mx72 Module DDR3-1066 DDR3-1333 DDR3-1600 Symbol 11-11-11 UnitIDD Spec Table M391B5773DH0 2GB256Mx72 ModuleCZQ Input/Output CapacitanceRefresh Parameters by Device Density Electrical Characteristics and AC timingDDR3-1066 Speed Bins DDR3-1600 Speed Bins CL-nRCD-nRP Speed Bin Table NotesDatasheet Timing Parameters by Speed Bin Timing Parameters by Speed GradeMIN MAX Reset Timing Jitter Notes ZQCorrection TSens x Tdriftrate + VSens x Vdriftrate Timing Parameter Notes18.1 256Mbx8 based 256Mx72 Module 1 Rank M391B5773DH0 Physical Dimensions18.2 256Mbx8 based 512Mx72 Module 2 Ranks M391B5273DH0