1-20 Hardware Specifications and Configurations
System Board
Processor
Processor Specifications
Heat Sink Fan True Value Table
Item Specification
Core logic Mobile Intel® HM77 (6MB BIOS ROM) Chipset
Graphics UM A: In te gr at ed in the Intel® Core™ Mobile Processor
USB 2.0 Integrated in the Mobile Intel® HM65 Express Chipset
Wireless LAN Foxconn BCM 43225
Foxconn Atheros HB97
Intel® Centrino® Advanced-N 6205 (Taylor Peak)
Audio codec Realtek 271X VB3
Card reader Built-in
Item Specification
CPU type Second Generation Intel® Core™ Mobile Processor Family
Core logic Four execution cores·
L1 cache size: Two 32 KB instruction caches and two 32 KB data
caches
L2 cache size: Two 256 KB
L3 cache size: 3 to 8 MB
Chipset Mobile Intel® UM67 (4MB SPI) Chipset
Item CPU
Speed Cores/
Threads Max Turbo
Freq Mfg
Tech L3
Cache Max
TDP Core
Voltage
i3-2367M 1.4 GHz 2C/4T 1.4 GHz 32 nm 3 MB 17 W 1.1 V
i3-3217U 1.8 GHz 2C/4T 1.8 GHz 32 nm 3 MB 17 W 1.1 V
i5-2467M 1.6 GHz 2C/4T 2.3 GHz 32 nm 3 MB 17 W 1.1 V
i5-3317U 1.7 GHz 2C/4T 2.3 GHz 32 nm 3 MB 17 W 1.1 V
i7-2637M 1.7 GHz 2C/4T 2.8 GHz 32 nm 4 MB 17 W 1.1 V
i7-3517U 1.9 GHz 2C/4T 2.8 GHz 32 nm 4 MB 17 W 1.1 V
CPU Temperature Fan Speed (RPM) SPL Spec (dBA)
44 2300 25
47 4450 28
52 4850 31