PRELIMINARY CY8CNP102B, CY8CNP102E

Packaging Information

This section describes the packaging specifications for the PSoC NV device and the thermal impedances for TQFP package.

Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation tool dimensions, refer to the document “PSoC Emulator Pod Dimensions” at http://www.cypress.com/design/MR10161.

Package Diagrams

Figure 15. 100-Pin TQFP - 14 x 14 x 1.4 mm

51-85048 *C

Thermal Impedance

Table 41. Thermal Impedance

 

 

 

 

 

Package[10]

Typical θJA *

Typical θJC *

100 TQFP

26.14 oC/W

5.81 oC/W

Note

10. * TJ = TA + POWER x θJA

Document #: 001-43991 Rev. *D

Page 36 of 38

[+] Feedback

Page 36
Image 36
Cypress CY8CNP102E, CY8CNP102B manual Package Diagrams, Thermal Impedance, Tqfp, 81 oC/W