Dell 4100/200, 4100/180 manual Remove the heat sink, Remove the microprocessor chip from the socket

Upgrading the Microprocessor or Installing a Secondary Microprocessor

In addition to the zero insertion force (ZIF) socket for the primary microprocessor on the system board, there is a second ZIF socket to accommodate a secondary micro- processor. The secondary microprocessor must have the same operating frequency as the primary microprocessor. For example, if the system has a 180 megahertz (MHz) Pentium Pro primary microprocessor, your secondary microprocessor must also be a 180-MHz Pentium Pro microprocessor.

NOTE: If you are upgrading a system by installing a sec- ondary microprocessor, you must order a microprocessor upgrade kit from Dell. The upgrade kit from Dell con- tains the correct version of the microprocessor for use as a secondary microprocessor. Not all versions of the Pen- tium Pro microprocessor will work properly as a secondary microprocessor.

The following items are included in a microprocessor upgrade kit:

•The new microprocessor chip

•A new heat sink

•A new heat sink clip

•A new snap-in badge

Use the following procedure to remove the old micro- processor and install the upgrade or to add a second microprocessor.

1.Remove the left computer cover.

See “Removing the Computer Covers” in Chapter 7.

CAUTION: See “Protecting Against Electro- static Discharge” in the safety instructions at the front of this guide.

2.Remove the metal clip that secures the heat sink to the microprocessor socket.

CAUTION: Never remove the heat sink from a microprocessor unless you intend to remove the microprocessor. The heat sink is necessary to maintain proper thermal conditions.

WARNING: The microprocessor chip and heat sink can get extremely hot. Be sure the micro- processor has had sufficient time to cool before you touch it.

Press down on the folded part of the clip with a small screwdriver to release the clip (see Figure 8-6).

press here to release clip

microprocessor securing clip hooks over tabs on front and back of socket

Figure 8-6. Microprocessor Securing Clip

3.Remove the heat sink.

The thermal interface pad is bonded to the heat sink and will remain attached to the old heat sink.

4.Remove the microprocessor chip from the socket.

CAUTION: Be careful not to bend any of the pins when removing the microprocessor chip from its socket. Bending the pins can perma- nently damage the microprocessor chip.

Installing System Board Options 8-7