Contents |
| |
B | Support and warranty |
|
| Obtain electronic support........................................................................................................ | 244 |
| Warranty................................................................................................................................. | 245 |
| Ink cartridge warranty information.......................................................................................... | 246 |
| Obtain HP telephone support................................................................................................. | 247 |
| Support process............................................................................................................... | 247 |
| Before you call.................................................................................................................. | 247 |
| HP support by phone........................................................................................................ | 248 |
| Phone support period................................................................................................. | 248 |
| Telephone support numbers....................................................................................... | 249 |
| Placing a call............................................................................................................... | 250 |
| After the phone support period................................................................................... | 250 |
| Additional warranty options.............................................................................................. | 250 |
| HP Quick Exchange Service (Japan)............................................................................... | 251 |
| HP Korea customer support............................................................................................. | 251 |
| Prepare the device for shipment............................................................................................. | 252 |
| Remove the device | 252 |
| Remove the rear access panel or duplexer...................................................................... | 254 |
| Remove the output tray.................................................................................................... | 254 |
| Pack the device...................................................................................................................... | 255 |
C | Device specifications |
|
| Physical specifications............................................................................................................ | 256 |
| Product features and capacities............................................................................................. | 256 |
| Processor and memory specifications.................................................................................... | 257 |
| System requirements.............................................................................................................. | 257 |
| Network protocol specifications.............................................................................................. | 258 |
| Embedded Web server specifications.................................................................................... | 258 |
| Print specifications.................................................................................................................. | 259 |
| Copy specifications................................................................................................................. | 259 |
| Fax specifications................................................................................................................... | 259 |
| Scan specifications................................................................................................................. | 260 |
| Environmental specifications.................................................................................................. | 260 |
| Electrical specifications.......................................................................................................... | 260 |
| Acoustic emission specifications (print in Draft mode, noise levels per ISO 7779)................ | 261 |
| Memory card specifications.................................................................................................... | 261 |
D | Regulatory information |
|
| FCC statement........................................................................................................................ | 263 |
| Notice to users in Korea......................................................................................................... | 263 |
| VCCI (Class B) compliance statement for users in Japan...................................................... | 263 |
| Notice to users in Japan about the power cord...................................................................... | 264 |
| Toxic and hazardous substance table.................................................................................... | 264 |
| LED indicator statement......................................................................................................... | 264 |
| Noise emission statement for Germany................................................................................. | 264 |
| Notice to users of the U.S. telephone network: FCC requirements........................................ | 265 |
| Notice to users of the Canadian telephone network............................................................... | 265 |
| Notice to users in the European Economic Area.................................................................... | 267 |
| Notice to users of the German telephone network................................................................. | 267 |
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