Regulatory Compliance

Table 16. Lead-Free Second Level Interconnect Marks

Description

Mark

 

 

 

 

 

 

 

 

 

This symbol is used to identify

 

 

 

 

 

 

 

 

 

 

 

 

 

 

electrical and electronic

 

 

 

 

 

 

 

assemblies and components in

 

 

 

 

 

 

 

which the Pb concentration

 

 

 

 

 

 

 

level in the board substrate

 

 

 

 

 

 

 

and the solder connections

 

 

 

 

 

 

 

 

 

 

 

 

 

 

from the board to the

 

 

 

or

 

components (second-level

 

 

 

 

 

 

 

 

 

 

 

interconnect) is not greater

 

 

 

 

 

 

 

 

 

 

 

 

 

 

than 0.1% by weight

 

 

 

 

 

 

 

(1000 ppm).

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

or

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Restriction of Hazardous Substances (RoHS)

EU RoHS

EU RoHS Directive 2002/95/EC restricts the use of the following six materials in various types of electronic and electrical equipment:

Lead

Mercury

Cadmium

Hexavalent chromium

Polybrominated biphenyls (PBB)

Polybrominated diphenyl ether (PBDE)

The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material.

Intel Mobile Board MGM45WU complies with these restrictions.

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Intel MGM45WU manual Restriction of Hazardous Substances RoHS, Lead-Free Second Level Interconnect Marks, Description Mark