Toshiba B-852 owner manual Recommended Media and Ribbon Types, Media type Description

7. SUPPLY SPECIFICATIONS

ENGLISH VERSION EO1-33055

7.2 Ribbon

7.2 Ribbon

Please make sure that the ribbon being used is approved by TOSHIBA TEC. The warranty does not apply to any problem caused by using non-approved ribbons.

For information regarding TOSHIBA TEC approved ribbon, please contact a sales representative.

Type	Spool type
Width	120 – 220 mm
	Recommended width is 120, 160 and 220 mm.
Length	300 m
Outside Diameter	φ72 mm (max.)

The table below shows the correlation between ribbon width and media width (backing paper is not included).

Ribbon width	Media width
120 mm	100 – 110 mm
160 mm	110 – 150 mm
220 mm	150 – 242 mm

NOTES:

1.To ensure print quality and print head life use only TOSHIBA TEC specified ribbons.

2.To avoid ribbon wrinkles use a ribbon that is wider than the media by 10 mm or more. However, too much difference in width between the two may cause wrinkles.

7.3Recommended Media and Ribbon Types

Media type	Description
Vellum paper and labels	General use for low cost applications.
Coated paper	Matt coated paper
	General use including applications that require small letters and/or symbols.
	Glossy coated paper
	Used where a high-grade finish is required
Plastic films	Synthetic film (Polypropylene, etc.)
	This water-proof and solvent-resistant material has high physical strength
	and low-temperature resistance, but poor heat resistance (dependant upon
	material). This material can be used for labels stuck to recyclable
	containers, so it can be recycled in the same process.
	PET film
	This water-proof and solvent-resistant material has high physical strength,
	and low-temperature resistance as well as heat resistance. This material is
	used for many applications, especially where high durability is required.
	Mode/serial plate labels, caution labels, etc.
	Polyimide
	This material gives the best performance on heat resistance (greater than
	PET film). It is often used for PCB labels as it can withstand passage
	through a solder bath.

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