Sun Microsystems SME5224AUPA-400 manual CPU Module Side View

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Bidirectional Airflow

UltraSPARC™-II CPU Module	Advanced Version
400 MHz CPU, 4.0 MB E-Cache	SME5224AUPA-400

Module

Shroud

Bidirectional

Airflow

Backside SRAM

Heat sink

Figure 8. CPU Module Side View

Provide Minimum Frontside Clearance 0.079 [2.00]

Maximum Card Guide Depth 0.087 [2.201]

0.298

[7.57] Maximum

1.318

[33.48] Maximum

0.062 + 0.008

[1.57 + 0.20]

Provide Minimum 0.079 [2.00] Backside Clearance

Dimensions: inches [millimeters]

Figure 9. CPU Module Side View Dimensions

NOTE: A minimum backside clearance is required for airﬂow cooling of the backside heatsink.

July 1999

Sun Microsystems, Inc

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Image 17

Contents Module Description Module Features Module BeneﬁtsEase of System Design PerformanceUltraSPARC-II CPU CPU Features CPU BeneﬁtsCPU Description UltraSPARC-II Data Buffer UDB-II Data Buffer DescriptionExternal Cache Description Module Component Overview Block DiagramUPA Interconnect UPA Connector PinsSystem Interface Jtag Interface Module PowerModule ID Signal Type Name and Function Signal DescriptionSystem Interface Clock InterfaceInitialization Interface Miscellaneous SignalsJTAG/Debug Interface System Clocks Module ClocksSystem Clock Distribution Tested CPU to UPAClock Signal Distribution Symbol Parameter Rating Units Electrical CharacteristicsSymbol Parameter Min Typ Max Units Absolute Maximum RatingsSymbol Parameter Conditions Min Typ Max Units DC CharacteristicsModule Power Consumption Module System Loading Example for UPADATA, Upaecc UPA Data Bus Spice ModelUpaclk Module Clocks Setup and Hold Time SpeciﬁcationsCpuclk Module Clock Clock BuffersMin Max Unit Propagation Delay, Output Hold Time SpeciﬁcationsTiming Measurement Waveforms CPU Module Components Mechanical SpecificationsCPU Module Side View Two Step Approach to Thermal Design Thermal SpecificationsTerm Deﬁnition Speciﬁcation Comments Thermal Deﬁnitions and SpeciﬁcationsAirﬂow Cooling Measurement Method Temperature Estimating and Measuring MethodsAir Velocity Speciﬁcations Air VelocityHeatsink Temperature Measuring Method Case Temperature Measuring MethodJtag Testability AC Characteristics Jtag TimingMHz CPU MHz TCK Symbol Parameter Signals Conditions Jtag Ieee 1149.1 Timing Pin UPA Connector PIN Assignments TOP ViewVddcore GND Vddcore GND Vddcore UPAPORTID1 UPA Connector PIN Assignments Bottom ViewValue Parameter Conditions Min Typ Storage and Shipping SpecificationHandling CPU Modules Document Revision History Ordering InformationPart Number CPU Speeds Description Date Document No ChangeSun Microsystems, Inc UltraSPARC -II CPU Module UltraSPARC-II CPU Data Buffer Description Block Diagram System Interface Module ID System Interface JTAG/Debug Interface UPA and CPU Clocks Clock Signal Distribution Absolute Maximum Ratings DC Characteristics UPA Data Bus Spice Model Upaclk Module Clocks Propagation Delay, Output Hold Time Speciﬁcations Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Deﬁnitions and Speciﬁcations Temperature Estimating and Measuring Methods Case Temperature Measuring Method AC Characteristics Jtag Timing Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Ordering Information Sun Microsystems, Inc