Sun Microsystems SME5224AUPA-400 manual Ordering Information, Document Revision History

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UltraSPARC-II CPU Module

Advanced Version

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

ORDERING INFORMATION [1]

Part Number

CPU Speeds

Description

SME5224AUPA-400

400 MHz CPU

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, features the UltraSPARC-II

 

 

CPU at 400 MHz, a 4.0 Mbyte external cache, and two UDB-II data buffer ASICs.

 

 

 

1. To order the data sheet for this device use the document part number: 805-6390-05

DOCUMENT REVISION HISTORY

Date

Document No.

Change

July 1999

805-4835-05

This module is designed using the the UltraSPARC™–II, 400 MHz CPU,

 

 

revision 3.x. See page 9, "Module Clocks," for changes effecting this version of

 

 

the module.

 

 

 

May 1999

805-6390-04

Re-organization of the datasheet and update of specifications.

 

 

 

March 1999

805-6390-03

New section concerning the System Timing and Thermal Specifications.

 

Preliminary Version

Revised specifications for DC characteristics and module power consumption.

 

 

 

December 1998

805-6390-02

Illustrations reflect a new heat sink design. Thermal section reflects the latest

 

Advanced Version

heatsink design.

 

 

 

July 1999

Sun Microsystems, Inc

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Contents Performance Module Features Module BenefitsModule Description Ease of System DesignCPU Features CPU Benefits CPU DescriptionUltraSPARC-II CPU Data Buffer Description External Cache DescriptionUltraSPARC-II Data Buffer UDB-II Module Component Overview Block DiagramUPA Connector Pins System InterfaceUPA Interconnect Module Power Module IDJtag Interface Clock Interface Signal DescriptionSignal Type Name and Function System InterfaceMiscellaneous Signals JTAG/Debug InterfaceInitialization Interface Tested CPU to UPA Module ClocksSystem Clocks System Clock DistributionClock Signal Distribution Absolute Maximum Ratings Electrical CharacteristicsSymbol Parameter Rating Units Symbol Parameter Min Typ Max UnitsDC Characteristics Module Power ConsumptionSymbol Parameter Conditions Min Typ Max Units Module System Loading Example for UPADATA, Upaecc UPA Data Bus Spice ModelClock Buffers Setup and Hold Time SpecificationsUpaclk Module Clocks Cpuclk Module ClockPropagation Delay, Output Hold Time Specifications Timing Measurement WaveformsMin Max Unit CPU Module Components Mechanical SpecificationsCPU Module Side View Two Step Approach to Thermal Design Thermal SpecificationsTerm Definition Specification Comments Thermal Definitions and SpecificationsAir Velocity Temperature Estimating and Measuring MethodsAirflow Cooling Measurement Method Air Velocity SpecificationsHeatsink Temperature Measuring Method Case Temperature Measuring MethodAC Characteristics Jtag Timing MHz CPU MHz TCK Symbol Parameter Signals ConditionsJtag Testability Jtag Ieee 1149.1 Timing Pin UPA Connector PIN Assignments TOP ViewVddcore GND Vddcore GND Vddcore UPAPORTID1 UPA Connector PIN Assignments Bottom ViewStorage and Shipping Specification Handling CPU ModulesValue Parameter Conditions Min Typ Date Document No Change Ordering InformationDocument Revision History Part Number CPU Speeds DescriptionSun Microsystems, Inc UltraSPARC -II CPU Module UltraSPARC-II CPU Data Buffer Description Block Diagram System Interface Module ID System Interface JTAG/Debug Interface UPA and CPU Clocks Clock Signal Distribution Absolute Maximum Ratings DC Characteristics UPA Data Bus Spice Model Upaclk Module Clocks Propagation Delay, Output Hold Time Specifications Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Definitions and Specifications Temperature Estimating and Measuring Methods Case Temperature Measuring Method AC Characteristics Jtag Timing Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Ordering Information Sun Microsystems, Inc