Sun Microsystems SME5224AUPA-400 manual Absolute Maximum Ratings

Page 39

UltraSPARC™-II CPU Module

Advanced Version

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings [1]

Symbol

Parameter

Rating

Units

VDD

Supply voltage range for I/O

0 to 3.8

V

VDD_CORE

Supply voltage range for CPU core

0 to 3.0

V

[2]

 

 

 

 

 

 

 

VI

Input voltage range [3]

-0.5 to VDD + 0.5

V

 

 

 

 

VO

Output voltage range

-0.5 to VDD + 0.5

V

 

 

 

 

IIK

Input clamp current

± 20

mA

IOK

Output clamp current

± 50

mA

IOL

Current into any output in the low state

50

mA

TSTG

Storage temperature (non-operating)

-40 to 90

°C

1.Operation of the device at values in excess of those listed above will result in degradation or destruction of the device. All voltages are defined with respect to ground. Functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2.The VDD_CORE supplies voltage to the onboard DC-DC regulator. The onboard DC-DC regulator then powers the CPU core and the SRAM I/O bus interface. The VDD_CORE must be lower than VDD, except when the CPU is being re-cycled, at which time the VDD can be lower than VDD_CORE for 30 ms or less, provided that the current is limited to twice thew maximum CPU rating.

3.Unless otherwise noted, all voltages are with respect to the VSS ground.

Recommended Operating Conditions

Symbol

Parameter

Min

Typ

Max

Units

VDD

Supply voltage for I/O

3.14

3.30

3.46

V

VDD_CORE

Supply voltage for the CPU core [1]

2.47

2.60

2.73

V

VSS

Ground

–

0

–

V

VIH

High-level input voltage

2.0

–

VDD + 0.2

V

VIL

Low-level input voltage

-0.3

–

0.8

V

IOH

High-level output current

–

–

-4

mA

IOL

Low-level output current

–

–

8

mA

TJ

Operating junction temperature

–

–

85

°C

 

 

 

 

 

 

T

Operating ambient temperature

–

–

– [2]

°C

A

 

 

 

 

 

1.A current of 2.6V supplies power to the DC-DC regulator which in turn supplies 1.9V to the CPU core.

2.Maximum ambient temperature is limited by airflow such that the maximum junction temperature does not exceed TJ. See the section "Thermal Specifications," on page 18.

July 1999

Sun Microsystems, Inc

11

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Contents Performance Module Features Module BenefitsModule Description Ease of System DesignCPU Features CPU Benefits CPU DescriptionUltraSPARC-II CPU Data Buffer Description External Cache DescriptionUltraSPARC-II Data Buffer UDB-II Module Component Overview Block DiagramUPA Connector Pins System InterfaceUPA Interconnect Module Power Module IDJtag Interface Clock Interface Signal DescriptionSignal Type Name and Function System InterfaceMiscellaneous Signals JTAG/Debug InterfaceInitialization Interface Tested CPU to UPA Module ClocksSystem Clocks System Clock DistributionClock Signal Distribution Absolute Maximum Ratings Electrical CharacteristicsSymbol Parameter Rating Units Symbol Parameter Min Typ Max UnitsDC Characteristics Module Power ConsumptionSymbol Parameter Conditions Min Typ Max Units Module System Loading Example for UPADATA, Upaecc UPA Data Bus Spice ModelClock Buffers Setup and Hold Time SpecificationsUpaclk Module Clocks Cpuclk Module ClockPropagation Delay, Output Hold Time Specifications Timing Measurement WaveformsMin Max Unit CPU Module Components Mechanical SpecificationsCPU Module Side View Two Step Approach to Thermal Design Thermal SpecificationsTerm Definition Specification Comments Thermal Definitions and SpecificationsAir Velocity Temperature Estimating and Measuring MethodsAirflow Cooling Measurement Method Air Velocity SpecificationsHeatsink Temperature Measuring Method Case Temperature Measuring MethodAC Characteristics Jtag Timing MHz CPU MHz TCK Symbol Parameter Signals ConditionsJtag Testability Jtag Ieee 1149.1 Timing Pin UPA Connector PIN Assignments TOP ViewVddcore GND Vddcore GND Vddcore UPAPORTID1 UPA Connector PIN Assignments Bottom ViewStorage and Shipping Specification Handling CPU ModulesValue Parameter Conditions Min Typ Date Document No Change Ordering InformationDocument Revision History Part Number CPU Speeds DescriptionSun Microsystems, Inc UltraSPARC -II CPU Module UltraSPARC-II CPU Data Buffer Description Block Diagram System Interface Module ID System Interface JTAG/Debug Interface UPA and CPU Clocks Clock Signal Distribution Absolute Maximum Ratings DC Characteristics UPA Data Bus Spice Model Upaclk Module Clocks Propagation Delay, Output Hold Time Specifications Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Definitions and Specifications Temperature Estimating and Measuring Methods Case Temperature Measuring Method AC Characteristics Jtag Timing Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Ordering Information Sun Microsystems, Inc
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