Sun Microsystems SME5224AUPA-400 manual Module Component Overview, Block Diagram

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UltraSPARC™-II CPU Module

SME5224AUPA-400400 MHz CPU, 4.0 MB E-Cache

MODULE COMPONENT OVERVIEW

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, (SME5224AUPA-400), (see Figure 1), consists of the following components:

•UltraSPARC™-II CPU at 400 MHz

•UltraSPARC-II Data Buffer (UDB-II)

•4.0 Megabyte E-cache, made up of eight (256K X 18) data SRAMs and one 128K X 36 Tag SRAM

•Clock Buffer: MC100LVE210

•DC-DC regulator (2.6V to 1.9V)

•Module Airﬂow Shroud

Block Diagram

The module block diagram for the UltraSPARC™–II, 400 MHz CPU, 4 Mbyte E-cache module is illustrated in Figure 1.

Tag SRAM ADDR [17:0] + Control

Tag SRAM DATA [24:0]

UltraSPARC-II

CPU

UPA ADDR [35:0] + Control

Tag SRAM 128K x 36

	1.9V
	DC-DC	Clock Buffer
	Regulator	Clock Buffer
	Regulator

	SRAM ADDR [19:0] + Control
SRAM	SRAM
256K x 18	256K x 18

DATA [143:72]	DATA [71:0]
UDB-II	UDB-II
	UDB-II
	Control

2.6V

Clocks

UPA_DATA [143:0]

UPA Connector

Figure 1. Module Block Diagram

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Sun Microsystems, Inc

July 1999

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Contents Module Features Module Beneﬁts Module DescriptionEase of System Design PerformanceCPU Description CPU Features CPU BeneﬁtsUltraSPARC-II CPU External Cache Description Data Buffer DescriptionUltraSPARC-II Data Buffer UDB-II Block Diagram Module Component OverviewSystem Interface UPA Connector PinsUPA Interconnect Module ID Module PowerJtag Interface Signal Description Signal Type Name and FunctionSystem Interface Clock InterfaceJTAG/Debug Interface Miscellaneous SignalsInitialization Interface Module Clocks System ClocksSystem Clock Distribution Tested CPU to UPAClock Signal Distribution Electrical Characteristics Symbol Parameter Rating UnitsSymbol Parameter Min Typ Max Units Absolute Maximum RatingsModule Power Consumption DC CharacteristicsSymbol Parameter Conditions Min Typ Max Units UPA Data Bus Spice Model Module System Loading Example for UPADATA, UpaeccSetup and Hold Time Speciﬁcations Upaclk Module ClocksCpuclk Module Clock Clock BuffersTiming Measurement Waveforms Propagation Delay, Output Hold Time SpeciﬁcationsMin Max Unit Mechanical Specifications CPU Module ComponentsCPU Module Side View Thermal Specifications Two Step Approach to Thermal DesignThermal Deﬁnitions and Speciﬁcations Term Deﬁnition Speciﬁcation CommentsTemperature Estimating and Measuring Methods Airﬂow Cooling Measurement MethodAir Velocity Speciﬁcations Air VelocityCase Temperature Measuring Method Heatsink Temperature Measuring MethodMHz CPU MHz TCK Symbol Parameter Signals Conditions AC Characteristics Jtag TimingJtag Testability Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View PinUPA Connector PIN Assignments Bottom View Vddcore GND Vddcore GND Vddcore UPAPORTID1Handling CPU Modules Storage and Shipping SpecificationValue Parameter Conditions Min Typ Ordering Information Document Revision HistoryPart Number CPU Speeds Description Date Document No ChangeSun Microsystems, Inc UltraSPARC -II CPU Module UltraSPARC-II CPU Data Buffer Description Block Diagram System Interface Module ID System Interface JTAG/Debug Interface UPA and CPU Clocks Clock Signal Distribution Absolute Maximum Ratings DC Characteristics UPA Data Bus Spice Model Upaclk Module Clocks Propagation Delay, Output Hold Time Speciﬁcations Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Deﬁnitions and Speciﬁcations Temperature Estimating and Measuring Methods Case Temperature Measuring Method AC Characteristics Jtag Timing Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Ordering Information Sun Microsystems, Inc