Texas Instruments TMS3320C5515 manual IDLE3 Procedure, Core Voltage Scaling

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Power Management

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1.5.5.2IDLE3 Procedure

In this power configuration all the power domains are turned on, the CPU and clock generator domains are disabled, and the RTC clock domain is enabled. The DSP peripherals and the USB are also disabled in this mode. When you enter this power configuration, all CPU and peripheral activity in the DSP is stopped.

Since the clock generator domain is disabled, you must allow enough time for the PLL to re-lock before exiting this power configuration.

Follow these steps to enter the IDLE3 power configuration:

1.Wait for completion of all DMA transfers. You can poll the DMA transfer status and disable DMA transfers through the DMA registers.

2.Disable the USB clock domain as described in Section 1.5.3.4.

3.Idle all the desired peripherals in the peripheral clock domain by modifying the peripheral clock gating configuration registers (PCGCR1 and PCGCR2). See Section 1.5.3.2 for more details on setting the DSP peripherals to idle mode.

4.Disable the clock generator domain as described in Section 1.5.3.3.

5.Clear all interrupts by writing ones to the CPU interrupt flag registers (IFR0 and IFR1).

6.Enable the appropriate wake-up interrupt in the CPU interrupt enable registers (IER0 and IER1). If using the WAKEUP pin to exit this mode, configure the WAKEUP pin as input by setting WU_DIR = 1 in the RTC power management register (RTCPMGT). If using the RTC alarm or periodic interrupt as a wake-up event, the RTCINTEN bit must be set in the RTC interrupt enable register (RTCINTEN).

7.Disable the CPU domain by setting to 1 the CPUI, MPORTI, XPORTI, DPORTI, IPORTI, and CPI bits of the idle configuration register (ICR).

8.Apply the new idle configuration by executing the IDLE instruction. The content of ICR is copied to the idle status register (ISTR). The bits of ISTR are then propagated through the CPU domain system to enable or disable the specified clocks.

The IDLE instruction cannot be executed in parallel with another instruction.

To exit the IDLE3 power configuration, follow these steps:

1.Generate the wake-up interrupt you specified during the IDLE3 power down procedure.

2.After the interrupt is generated, the DSP will execute the interrupt service routine.

3.After exiting the interrupt service routine, code execution will resume from the point where the “IDLE” instruction was originally executed.

4.Enable the clock generator domain as described in Section 1.5.3.3. You can also enable the clock generator domain inside the interrupt service routine.

You can also exit the IDLE3 power configuration by generating a hardware reset, however, in this case the DSP is completely reset and the state of the DSP before going into IDLE3 is lost.

1.5.5.3Core Voltage Scaling

When the core voltage domain (CVDD) is ON, it can be set to two voltages: 1.3 V or 1.05 V (nominal). The core voltage can be reduced during periods of low processing demand and increased during high demand. Core voltage scaling can be accomplished with an external power management IC (LDO, DC-DC, etc) or with the on-chip DSP_LDO. When the core voltage is decreased (1.3 V to 1.05 V), care must be taken to ensure device stability. The following rules must be followed to maintain stability:

•When using an external PMIC (power management IC), the board designer must ensure that the 1.3 V

to 1.05 V transition does not have ringing that would violate our VDDC minimum rating (1.05 V - 5% = 0.998 V).

•Software must ensure that the clock speed of the device does not exceed the maximum speed of the device at the lower voltage before making the voltage transition. For example, if the device is running at 100 MHz @ 1.3 V, then the PLL must be changed to 60 MHz (for -100 parts) or 75 MHz (for -120 parts) before changing the core voltage to 1.05 V.

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System Control

SPRUFX5A –October 2010 –Revised November 2010

 

 

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Contents Users Guide Submit Documentation Feedback Contents List of Figures Submit Documentation Feedback List of Tables Submit Documentation Feedback Submit Documentation Feedback Read This First Related Documentation From Texas Instruments Related Documentation From Texas Instruments Submit Documentation Feedback Block Diagram Functional Block DiagramUsing FFT Accelerator ROM routines CPU CoreFFT Hardware Accelerator AddressPower Management PeripheralsSystem Memory Program/Data Memory MapOn-Chip Dual-Access RAM Daram Daram BlocksCPU Byte Address Range DaramSaram Blocks On-Chip Single-Access RAM SaramSaram On-Chip Single-Access Read-Only Memory Sarom Sarom BlocksExternal Memory Asynchronous Emif Interface2 I/O Memory Map OverviewDevice Clocking DSP Clocking Diagram Clock Domains PLL Output Frequency Configuration Powering Down and Powering Up the System PLLFunctional Description Multiplier and DividersSRC Clkout PinBit Field Value Description Configuration DSP Reset Conditions of the System Clock GeneratorClock Generator During Reset Clock Generator After ResetRegister Bits Used in the Bypass Mode Setting the System Clock Frequency In the Bypass ModeEntering and Exiting the PLL Mode Register Bits Used in the PLL ModeSetting the Output Frequency for the PLL Mode CV DD = 1.05 CV DD = 1.3 Clock Signal NameFrequency Ranges for Internal Clocks 10. PLL Clock Frequency RangesClock Generator Registers Lock TimeSoftware Steps To Modify Multiplier and Divider Ratios 12. Clock Generator RegistersClock Generator Control Register 1 CGCR1 1C20h Clock Generator Control Register 2 CGCR2 1C21hClock Generator Control Register 4 CGCR4 1C23h Clock Generator Control Register 3 CGCR3 1C22hInit Clock Configuration Register 1 CCR1 1C1Eh 17. Clock Configuration Register 1 CCR1 Field DescriptionsClock Configuration Register 2 CCR2 1C1Fh 18. Clock Configuration Register 2 CCR2 Field DescriptionsPower Domains 19. Power Management FeaturesPower Domains Description 20. DSP Power DomainsClock Management CPU Domain Clock Gating DaramHwai Iporti Mporti Xporti Dporti Idlecfg Cpui 21. Idle Configuration Register ICR Field DescriptionsHwai 22. Idle Status Register Istr Field Descriptions Valid Idle Configurations23. CPU Clock Domain Idle Requirements Clock Configuration Process Peripheral Domain Clock GatingTo Idle the Following Module/Port XportMMCSD0CG DMA0CG Uartcg Spicg I2S3CG SysclkdisMMCSD0CG Anaregcg DMA3CG DMA2CG DMA1CG Usbcg Sarcg Lcdcg AnaregcgUrtclkstpack UrtclkstpreqUsbclkstpack UsbclkstpreqClock Generator Domain Clock Gating USB Domain Clock GatingBit Field EmfclkstpackUSB System Control Register Usbscr 1C32h 27. USB System Control Register Usbscr Field DescriptionsUsbpwdn Usbsessend Usbvbusdet Usbpllen UsbpwdnRTC Domain Clock Gating UsbdatpolUsboscbiasdis UsboscdisStatic Power Management RTC Power Management Register Rtcpmgt 1930hRTC Interrupt Flag Register Rtcintfl 1920h 29. RTC Interrupt Flag Register Rtcintfl Field DescriptionsInternal Memory Low Power Modes RAM Sleep Mode Control Register 1 RAMSLPMDCNTLR1 1C28hMode CV DD Voltage 30. On-Chip Memory Standby Modes21. RAM Sleep Mode Control Register2 0x1C2A Power Configurations 31. Power ConfigurationsDV DDRTC, Ldoi IDLE3IDLE2 Procedure IDLE3 Procedure Core Voltage Scaling32. Interrupt Table HEX BytesIFR and IER Registers 33. IFR0 and IER0 Bit DescriptionsInterrupt Timing 34. IFR1 and IER1 Bit DescriptionsRtos Dlog Berr I2C Emif Gpio USB SPI RTC RCV3 XMT3 RtosGpio Interrupt Enable and Aggregation Flag Registers Timer Interrupt Aggregation Flag Register Tiafr 1C14hDMA Interrupt Enable and Aggregation Flag Registers Device Identification 35. Die ID RegistersDie ID Register 0 DIEIDR0 1C40h 36. Die ID Register 0 DIEIDR0 Field DescriptionsDie ID Register 1 DIEIDR1 1C41h 37. Die ID Register 1 DIEIDR1 Field DescriptionsDie ID Register 3 DIEIDR3150 1C43h 39. Die ID Register 3 DIEIDR3150 Field DescriptionsDie ID Register 4 DIEIDR4 1C44h 40. Die ID Register 4 DIEIDR4 Field DescriptionsDie ID Register 6 DIEIDR6 1C46h 42. Die ID Register 6 DIEIDR6 Field DescriptionsDie ID Register 7 DIEIDR7 1C47h 43. Die ID Register 7 DIEIDR7 Field DescriptionsDevice Configuration External Bus Selection Register Ebsr44. Ebsr Register Bit Descriptions Field Descriptions LDO Control Register 7004h LDO ControlA17MODE A16MODE45. Rtcpmgt Register Bit Descriptions Field Descriptions 46. Ldocntl Register Bit Descriptions Field Descriptions 47. LDO Controls MatrixRtcpmgt Register Ldocntl Register Bgpd Bit Ldopd Bit Usbldoen BitClkoutsr Output Slew Rate Control Register Osrcr 1C16hEmifsr S15PD S14PD S13PD S12PD S11PD S10PD S05PD S04PD S03PD S02PD S01PD S00PDS15PD S05PDA20PD A19PD A18PD A17PD A16PD A15PD INT1PU INT0PU Resetpu EMU01PU Tdipu Tmspu TckpuINT1PU A20PD PD15PDDMA Controller Configuration DMA Configuration Registers DMA Synchronization Events52. Channel Synchronization Events for DMA Controllers 53. System Registers Related to the DMA Controllers55. DMA Interrupt Enable Register Dmaier Field Descriptions 54. DMA Interrupt Flag Register Dmaifr Field DescriptionsPeripheral Reset CH1EVTCH0EVT CH3EVTPeripheral Software Reset Counter Register Psrcr 1C04h Peripheral Reset Control Register Prcr 1C05hCount PG4RSTEmif and USB Byte Access PG3RST60. Effect of Bytemode Bits on Emif Accesses 61. Effect of Usbscr Bytemode Bits on USB AccessBytemode Setting CPU Access to USB Register Emif System Control Register Escr 1C33h63. Emif Clock Divider Register Ecdr Field Descriptions Emif Clock Divider Register Ecdr 1C26hEdiv DSP Products ApplicationsRfid

TMS3320C5515 specifications

The Texas Instruments TMS3320C5515 is a highly specialized digital signal processor (DSP) designed for a wide range of applications, including telecommunications, audio processing, and other signal-intensive tasks. As part of the TMS320 family of DSPs, the TMS3320C5515 leverages TI's extensive experience in signal processing technology, delivering robust performance and reliability.

One of the main features of the TMS3320C5515 is its 32-bit architecture, which allows for a high level of precision in digital signal computation. The processor is capable of executing complex mathematical algorithms, making it suitable for tasks that require high-speed data processing, such as speech recognition and audio filtering. With a native instruction set optimized for DSP applications, the TMS3320C5515 can perform multiply-accumulate operations in a single cycle, significantly enhancing computational efficiency.

The TMS3320C5515 employs advanced technologies including a Harvard architecture that separates instruction and data memory, enabling simultaneous access and improving performance. Its dual data buses enhance throughput by allowing multi-channel processing, making it particularly effective for real-time applications where timely data manipulation is critical. The device supports a wide range of peripherals, facilitating connections to various sensors and communication systems, which is vital in embedded applications.

In terms of characteristics, the TMS3320C5515 operates at an impressive clock speed, providing the computational power necessary to handle demanding tasks. The device is optimized for low power consumption, making it ideal for battery-operated applications without sacrificing performance. Its flexibility in processing algorithms also allows it to be readily adapted for specific requirements, from audio codecs to modems.

Another noteworthy aspect is the extensive development ecosystem surrounding the TMS3320C5515, which includes software tools, libraries, and support resources designed to accelerate the development process. This allows engineers and developers to bring their projects to market more quickly while minimizing risk.

Overall, the Texas Instruments TMS3320C5515 stands out as a powerful DSP solution, equipped with features that cater to the needs of various industries. Its combination of performance, efficiency, and versatile application makes it an attractive choice for engineers working in signal processing.
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