Texas Instruments TMS3320C5515 manual Interrupt Table, HEX Bytes

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Interrupts

When the core voltage is increased (1.05 V to 1.3 V) clock speed is not an issue since the device can operate faster at the higher voltage. However, when switching from 1.05 V to 1.3 V software must allow time for the voltage transition to reach the 1.3 V range. Additionally, external regulators might produce an overshoot that must not pass the maximum operational voltage of the core supply (see the Recommended Operating Conditions section in device-specific data manual). Otherwise, the device will be operating out of specification. This could happen if large current draw occurs while the regulator transitions to the higher voltage.

For external PMICs, the step response varies greatly and it is up to the system designer to ensure that the ringing is maintained within the DSP'score supply high voltage operational tolerance (see the Recommended Operating Conditions section in device-specific data manual).

1.6Interrupts

Vector-relative locations and priorities for all internal and external interrupts are shown in Table 1-32.

Table 1-32. Interrupt Table

 

SOFTWARE

RELATIVE

 

 

NAME

(TRAP)

LOCATION

PRIORITY

FUNCTION

 

EQUIVALENT

(HEX BYTES) (1)

 

 

RESET

SINT0

0x0

0

Reset (hardware and software)

 

 

 

 

 

NMI(2)

SINT1

0x8

1

Non-maskable interrupt

INT0

SINT2

0x10

3

External user interrupt #0

 

 

 

 

 

INT1

SINT3

0x18

5

External user interrupt #1

 

 

 

 

 

TINT

SINT4

0x20

6

Timer aggregated interrupt

 

 

 

 

 

PROG0

SINT5

0x28

7

Programmable transmit interrupt 0 (I2S0 transmit or

 

 

 

 

MMC/SD0 interrupt)

 

 

 

 

 

UART

SINT6

0x30

9

UART interrupt

 

 

 

 

 

PROG1

SINT7

0x38

10

Programmable receive interrupt 1 (I2S0 receive or

 

 

 

 

MMC/SD0 SDIO interrupt)

 

 

 

 

 

DMA

SINT8

0x40

11

DMA aggregated interrupt

 

 

 

 

 

PROG2

SINT9

0x48

13

Programmable transmit interrupt 1 (I2S1 transmit or

 

 

 

 

MMC/SD1 interrupt)

 

 

 

 

 

-

SINT10

0x50

14

Software interrupt

 

 

 

 

 

PROG3

SINT11

0x58

15

Programmable receive interrupt 3 (I2S1 Receive or

 

 

 

 

MMC/SD1 SDIO interrupt)

 

 

 

 

 

LCD

SINT12

0x60

17

LCD interrupt

 

 

 

 

 

SAR

SINT13

0x68

18

10-bit SAR A/D conversion or pin interrupt

 

 

 

 

 

XMT2

SINT14

0x70

21

I2S2 transmit interrupt

 

 

 

 

 

RCV2

SINT15

0x78

22

I2S2 receive interrupt

 

 

 

 

 

XMT3

SINT16

0x80

4

I2S3 transmit interrupt

 

 

 

 

 

RCV3

SINT17

0x88

8

I2S3 receive interrupt

 

 

 

 

 

RTC

SINT18

0x90

12

Wakeup or real-time clock interrupt

 

 

 

 

 

SPI

SINT19

0x98

16

SPI interrupt

 

 

 

 

 

USB

SINT20

0xA0

19

USB Interrupt

 

 

 

 

 

GPIO

SINT21

0xA8

20

GPIO aggregated interrupt

 

 

 

 

 

EMIF

SINT22

0xB0

23

EMIF error interrupt

 

 

 

 

 

I2C

SINT23

0xB8

24

I2C interrupt

 

 

 

 

 

BERR

SINT24

0xC0

2

Bus error interrupt

 

 

 

 

 

DLOG

SINT25

0xC8

25

Data log interrupt

 

 

 

 

 

RTOS

SINT26

0xD0

26

Real-time operating system interrupt

 

 

 

 

 

-

SINT27

0xD8

14

Software interrupt #27

 

 

 

 

 

(1)Absolute addresses of the interrupt vector locations are determined by the contents of the IVPD and IVPH registers. Interrupt vectors for interrupts 0-15 and 24-31 are relative to IVPD. Interrupt vectors for interrupts 16-23 are relative to IVPH.

(2)The NMI signal is internally tied high (not asserted). However, NMI interrupt vector can be used for SINT1.

SPRUFX5A –October 2010 –Revised November 2010

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Contents Users Guide Submit Documentation Feedback Contents List of Figures Submit Documentation Feedback List of Tables Submit Documentation Feedback Submit Documentation Feedback Read This First Related Documentation From Texas Instruments Related Documentation From Texas Instruments Submit Documentation Feedback Functional Block Diagram Block DiagramCPU Core Using FFT Accelerator ROM routinesFFT Hardware Accelerator AddressPeripherals Power ManagementProgram/Data Memory Map System MemoryDaram Blocks On-Chip Dual-Access RAM DaramCPU Byte Address Range DaramSaram On-Chip Single-Access RAM SaramSaram Blocks Sarom Blocks On-Chip Single-Access Read-Only Memory SaromExternal Memory Asynchronous Emif InterfaceOverview 2 I/O Memory MapDevice Clocking DSP Clocking Diagram Clock Domains Powering Down and Powering Up the System PLL PLL Output Frequency ConfigurationFunctional Description Multiplier and DividersBit Field Value Description Clkout PinSRC DSP Reset Conditions of the System Clock Generator ConfigurationClock Generator During Reset Clock Generator After ResetSetting the System Clock Frequency In the Bypass Mode Register Bits Used in the Bypass ModeEntering and Exiting the PLL Mode Register Bits Used in the PLL ModeCV DD = 1.05 CV DD = 1.3 Clock Signal Name Setting the Output Frequency for the PLL ModeFrequency Ranges for Internal Clocks 10. PLL Clock Frequency RangesLock Time Clock Generator RegistersSoftware Steps To Modify Multiplier and Divider Ratios 12. Clock Generator RegistersClock Generator Control Register 2 CGCR2 1C21h Clock Generator Control Register 1 CGCR1 1C20hInit Clock Generator Control Register 3 CGCR3 1C22hClock Generator Control Register 4 CGCR4 1C23h 17. Clock Configuration Register 1 CCR1 Field Descriptions Clock Configuration Register 1 CCR1 1C1EhClock Configuration Register 2 CCR2 1C1Fh 18. Clock Configuration Register 2 CCR2 Field Descriptions19. Power Management Features Power DomainsClock Management 20. DSP Power DomainsPower Domains Description Daram CPU Domain Clock GatingHwai 21. Idle Configuration Register ICR Field DescriptionsHwai Iporti Mporti Xporti Dporti Idlecfg Cpui 23. CPU Clock Domain Idle Requirements Valid Idle Configurations22. Idle Status Register Istr Field Descriptions Peripheral Domain Clock Gating Clock Configuration ProcessTo Idle the Following Module/Port XportSysclkdis MMCSD0CG DMA0CG Uartcg Spicg I2S3CGMMCSD0CG Anaregcg Anaregcg DMA3CG DMA2CG DMA1CG Usbcg Sarcg LcdcgUrtclkstpreq UrtclkstpackUsbclkstpack UsbclkstpreqUSB Domain Clock Gating Clock Generator Domain Clock GatingBit Field Emfclkstpack27. USB System Control Register Usbscr Field Descriptions USB System Control Register Usbscr 1C32hUsbpwdn Usbsessend Usbvbusdet Usbpllen UsbpwdnUsbdatpol RTC Domain Clock GatingUsboscbiasdis UsboscdisRTC Power Management Register Rtcpmgt 1930h Static Power Management29. RTC Interrupt Flag Register Rtcintfl Field Descriptions RTC Interrupt Flag Register Rtcintfl 1920hRAM Sleep Mode Control Register 1 RAMSLPMDCNTLR1 1C28h Internal Memory Low Power ModesMode CV DD Voltage 30. On-Chip Memory Standby Modes21. RAM Sleep Mode Control Register2 0x1C2A 31. Power Configurations Power ConfigurationsDV DDRTC, Ldoi IDLE3IDLE2 Procedure Core Voltage Scaling IDLE3 ProcedureHEX Bytes 32. Interrupt Table33. IFR0 and IER0 Bit Descriptions IFR and IER Registers34. IFR1 and IER1 Bit Descriptions Interrupt TimingRtos Dlog Berr I2C Emif Gpio USB SPI RTC RCV3 XMT3 RtosDMA Interrupt Enable and Aggregation Flag Registers Timer Interrupt Aggregation Flag Register Tiafr 1C14hGpio Interrupt Enable and Aggregation Flag Registers 35. Die ID Registers Device Identification36. Die ID Register 0 DIEIDR0 Field Descriptions Die ID Register 0 DIEIDR0 1C40hDie ID Register 1 DIEIDR1 1C41h 37. Die ID Register 1 DIEIDR1 Field Descriptions39. Die ID Register 3 DIEIDR3150 Field Descriptions Die ID Register 3 DIEIDR3150 1C43hDie ID Register 4 DIEIDR4 1C44h 40. Die ID Register 4 DIEIDR4 Field Descriptions42. Die ID Register 6 DIEIDR6 Field Descriptions Die ID Register 6 DIEIDR6 1C46hDie ID Register 7 DIEIDR7 1C47h 43. Die ID Register 7 DIEIDR7 Field DescriptionsExternal Bus Selection Register Ebsr Device Configuration44. Ebsr Register Bit Descriptions Field Descriptions LDO Control LDO Control Register 7004hA17MODE A16MODE45. Rtcpmgt Register Bit Descriptions Field Descriptions 47. LDO Controls Matrix 46. Ldocntl Register Bit Descriptions Field DescriptionsRtcpmgt Register Ldocntl Register Bgpd Bit Ldopd Bit Usbldoen BitEmifsr Output Slew Rate Control Register Osrcr 1C16hClkoutsr S05PD S04PD S03PD S02PD S01PD S00PD S15PD S14PD S13PD S12PD S11PD S10PDS15PD S05PDINT1PU INT1PU INT0PU Resetpu EMU01PU Tdipu Tmspu TckpuA20PD A19PD A18PD A17PD A16PD A15PD PD15PD A20PDDMA Controller Configuration DMA Synchronization Events DMA Configuration Registers52. Channel Synchronization Events for DMA Controllers 53. System Registers Related to the DMA Controllers54. DMA Interrupt Flag Register Dmaifr Field Descriptions 55. DMA Interrupt Enable Register Dmaier Field DescriptionsCH1EVT Peripheral ResetCH0EVT CH3EVTPeripheral Reset Control Register Prcr 1C05h Peripheral Software Reset Counter Register Psrcr 1C04hCount PG4RSTPG3RST Emif and USB Byte Access61. Effect of Usbscr Bytemode Bits on USB Access 60. Effect of Bytemode Bits on Emif AccessesBytemode Setting CPU Access to USB Register Emif System Control Register Escr 1C33hEdiv Emif Clock Divider Register Ecdr 1C26h63. Emif Clock Divider Register Ecdr Field Descriptions Rfid Products ApplicationsDSP

TMS3320C5515 specifications

The Texas Instruments TMS3320C5515 is a highly specialized digital signal processor (DSP) designed for a wide range of applications, including telecommunications, audio processing, and other signal-intensive tasks. As part of the TMS320 family of DSPs, the TMS3320C5515 leverages TI's extensive experience in signal processing technology, delivering robust performance and reliability.

One of the main features of the TMS3320C5515 is its 32-bit architecture, which allows for a high level of precision in digital signal computation. The processor is capable of executing complex mathematical algorithms, making it suitable for tasks that require high-speed data processing, such as speech recognition and audio filtering. With a native instruction set optimized for DSP applications, the TMS3320C5515 can perform multiply-accumulate operations in a single cycle, significantly enhancing computational efficiency.

The TMS3320C5515 employs advanced technologies including a Harvard architecture that separates instruction and data memory, enabling simultaneous access and improving performance. Its dual data buses enhance throughput by allowing multi-channel processing, making it particularly effective for real-time applications where timely data manipulation is critical. The device supports a wide range of peripherals, facilitating connections to various sensors and communication systems, which is vital in embedded applications.

In terms of characteristics, the TMS3320C5515 operates at an impressive clock speed, providing the computational power necessary to handle demanding tasks. The device is optimized for low power consumption, making it ideal for battery-operated applications without sacrificing performance. Its flexibility in processing algorithms also allows it to be readily adapted for specific requirements, from audio codecs to modems.

Another noteworthy aspect is the extensive development ecosystem surrounding the TMS3320C5515, which includes software tools, libraries, and support resources designed to accelerate the development process. This allows engineers and developers to bring their projects to market more quickly while minimizing risk.

Overall, the Texas Instruments TMS3320C5515 stands out as a powerful DSP solution, equipped with features that cater to the needs of various industries. Its combination of performance, efficiency, and versatile application makes it an attractive choice for engineers working in signal processing.
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