Texas Instruments TMS3320C5515 manual Power Domains, Power Management Features

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Power Management

1.5Power Management

1.5.1 Overview

In many applications there may be specific requirements to minimize power consumption for both power supply (and battery) and thermal considerations. There are two components to power consumption: active power and leakage power. Active power is the power consumed to perform work and, for digital CMOS circuits, scales roughly with clock frequency and the amount of computations being performed. Active power can be reduced by controlling the clocks in such a way as to either operate at a clock frequency just high enough to complete the required operation in the required time-line or to run at a high enough clock frequency until the work is complete and then drastically cut the clocks (that is, to bypass mode or clock gate) until additional work must be performed.

Leakage power is due to static current leakage and occurs regardless of the clock rate. Leakage, or standby power, is unavoidable while power is applied and scales roughly with the operating junction temperatures. Leakage power can only be avoided by removing power completely.

The DSP has several means of managing the power consumption, as detailed in the following sections. There is extensive use of automatic clock gating in the design as well as software-controlled module clock gating to not only reduce the clock tree power, but to also reduce module power by freezing its state while not operating. Clock management enables you to slow the clocks down on the chip in order to reduce switching power. Independent power domains allow you to shut down parts of the DSP to reduce static power consumption. When not being used, the internal memory of the DSP can also be placed in a low leakage power mode while preserving the memory contents. The operating voltage and drive strength of the I/O pins can also be reduced to decrease I/O power consumption.

Table 1-19summarizes all of the power management features included in the DSP.

Table 1-19. Power Management Features

Power Management Features

 

Description

 

 

 

 

Clock Management

 

 

 

PLL power-down

 

The system PLL can be powered-down when not in use to

 

 

reduce switching and bias power.

 

 

 

Peripheral clock idle

 

Peripheral clocks can be idled to reduce switching power.

 

 

 

 

Dynamic Power Management

 

 

 

Core Voltage Scaling

 

The DSP LDO and DSP logic support two voltage ranges to

 

 

allow voltage adjustments on-the-fly, increasing voltage during

 

 

peak processing power demand and decreasing during low

 

 

demand.

 

 

 

 

Static Power Management

 

 

 

DARAM/SARAM low power modes

 

The internal memory of the DSP can be placed in a low leakage

 

 

power mode while preserving memory contents.

 

 

 

Independent power domains

 

DSP Core (CVDD) and USB Core (USB_VDD1P3, USB_VDDA1P3)

 

 

can be shut off while other supplies remain powered.

 

 

 

 

I/O Management

 

 

 

I/O voltage selection

 

The operating voltage and/or slew rate of the I/O pins can be

 

 

reduced (at the expense of performance) to decrease I/O power

 

 

consumption.

 

 

 

USB power-down

 

The USB peripheral can be powered-down when not being

 

 

used.

 

 

 

1.5.2 Power Domains

The DSP has separate power domains which provide power to different portions of the device. The separate power domains allow the user to select the optimal voltage to achieve the lowest power consumption at the best possible performance. Note that several power domains have similar voltage requirements and, therefore, could be grouped under a single voltage domain.

SPRUFX5A –October 2010 –Revised November 2010

System Control

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Copyright © 2010, Texas Instruments Incorporated

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Contents Users Guide Submit Documentation Feedback Contents List of Figures Submit Documentation Feedback List of Tables Submit Documentation Feedback Submit Documentation Feedback Read This First Related Documentation From Texas Instruments Related Documentation From Texas Instruments Submit Documentation Feedback Functional Block Diagram Block DiagramCPU Core Using FFT Accelerator ROM routinesFFT Hardware Accelerator AddressPeripherals Power ManagementProgram/Data Memory Map System MemoryDaram Blocks On-Chip Dual-Access RAM DaramCPU Byte Address Range DaramOn-Chip Single-Access RAM Saram Saram BlocksSaram Sarom Blocks On-Chip Single-Access Read-Only Memory SaromExternal Memory Asynchronous Emif InterfaceOverview 2 I/O Memory MapDevice Clocking DSP Clocking Diagram Clock Domains Powering Down and Powering Up the System PLL PLL Output Frequency ConfigurationFunctional Description Multiplier and DividersClkout Pin SRCBit Field Value Description DSP Reset Conditions of the System Clock Generator ConfigurationClock Generator During Reset Clock Generator After ResetSetting the System Clock Frequency In the Bypass Mode Register Bits Used in the Bypass ModeEntering and Exiting the PLL Mode Register Bits Used in the PLL ModeCV DD = 1.05 CV DD = 1.3 Clock Signal Name Setting the Output Frequency for the PLL ModeFrequency Ranges for Internal Clocks 10. PLL Clock Frequency RangesLock Time Clock Generator RegistersSoftware Steps To Modify Multiplier and Divider Ratios 12. Clock Generator RegistersClock Generator Control Register 2 CGCR2 1C21h Clock Generator Control Register 1 CGCR1 1C20hClock Generator Control Register 3 CGCR3 1C22h Clock Generator Control Register 4 CGCR4 1C23hInit 17. Clock Configuration Register 1 CCR1 Field Descriptions Clock Configuration Register 1 CCR1 1C1EhClock Configuration Register 2 CCR2 1C1Fh 18. Clock Configuration Register 2 CCR2 Field Descriptions19. Power Management Features Power Domains20. DSP Power Domains Power Domains DescriptionClock Management Daram CPU Domain Clock Gating21. Idle Configuration Register ICR Field Descriptions Hwai Iporti Mporti Xporti Dporti Idlecfg CpuiHwai Valid Idle Configurations 22. Idle Status Register Istr Field Descriptions23. CPU Clock Domain Idle Requirements Peripheral Domain Clock Gating Clock Configuration ProcessTo Idle the Following Module/Port XportSysclkdis MMCSD0CG DMA0CG Uartcg Spicg I2S3CGMMCSD0CG Anaregcg Anaregcg DMA3CG DMA2CG DMA1CG Usbcg Sarcg LcdcgUrtclkstpreq UrtclkstpackUsbclkstpack UsbclkstpreqUSB Domain Clock Gating Clock Generator Domain Clock GatingBit Field Emfclkstpack27. USB System Control Register Usbscr Field Descriptions USB System Control Register Usbscr 1C32hUsbpwdn Usbsessend Usbvbusdet Usbpllen UsbpwdnUsbdatpol RTC Domain Clock GatingUsboscbiasdis UsboscdisRTC Power Management Register Rtcpmgt 1930h Static Power Management29. RTC Interrupt Flag Register Rtcintfl Field Descriptions RTC Interrupt Flag Register Rtcintfl 1920hRAM Sleep Mode Control Register 1 RAMSLPMDCNTLR1 1C28h Internal Memory Low Power ModesMode CV DD Voltage 30. On-Chip Memory Standby Modes21. RAM Sleep Mode Control Register2 0x1C2A 31. Power Configurations Power ConfigurationsDV DDRTC, Ldoi IDLE3IDLE2 Procedure Core Voltage Scaling IDLE3 ProcedureHEX Bytes 32. Interrupt Table33. IFR0 and IER0 Bit Descriptions IFR and IER Registers34. IFR1 and IER1 Bit Descriptions Interrupt TimingRtos Dlog Berr I2C Emif Gpio USB SPI RTC RCV3 XMT3 RtosTimer Interrupt Aggregation Flag Register Tiafr 1C14h Gpio Interrupt Enable and Aggregation Flag RegistersDMA Interrupt Enable and Aggregation Flag Registers 35. Die ID Registers Device Identification36. Die ID Register 0 DIEIDR0 Field Descriptions Die ID Register 0 DIEIDR0 1C40hDie ID Register 1 DIEIDR1 1C41h 37. Die ID Register 1 DIEIDR1 Field Descriptions39. Die ID Register 3 DIEIDR3150 Field Descriptions Die ID Register 3 DIEIDR3150 1C43hDie ID Register 4 DIEIDR4 1C44h 40. Die ID Register 4 DIEIDR4 Field Descriptions42. Die ID Register 6 DIEIDR6 Field Descriptions Die ID Register 6 DIEIDR6 1C46hDie ID Register 7 DIEIDR7 1C47h 43. Die ID Register 7 DIEIDR7 Field DescriptionsExternal Bus Selection Register Ebsr Device Configuration44. Ebsr Register Bit Descriptions Field Descriptions LDO Control LDO Control Register 7004hA17MODE A16MODE45. Rtcpmgt Register Bit Descriptions Field Descriptions 47. LDO Controls Matrix 46. Ldocntl Register Bit Descriptions Field DescriptionsRtcpmgt Register Ldocntl Register Bgpd Bit Ldopd Bit Usbldoen BitOutput Slew Rate Control Register Osrcr 1C16h ClkoutsrEmifsr S05PD S04PD S03PD S02PD S01PD S00PD S15PD S14PD S13PD S12PD S11PD S10PDS15PD S05PDINT1PU INT0PU Resetpu EMU01PU Tdipu Tmspu Tckpu A20PD A19PD A18PD A17PD A16PD A15PDINT1PU PD15PD A20PDDMA Controller Configuration DMA Synchronization Events DMA Configuration Registers52. Channel Synchronization Events for DMA Controllers 53. System Registers Related to the DMA Controllers54. DMA Interrupt Flag Register Dmaifr Field Descriptions 55. DMA Interrupt Enable Register Dmaier Field DescriptionsCH1EVT Peripheral ResetCH0EVT CH3EVTPeripheral Reset Control Register Prcr 1C05h Peripheral Software Reset Counter Register Psrcr 1C04hCount PG4RSTPG3RST Emif and USB Byte Access61. Effect of Usbscr Bytemode Bits on USB Access 60. Effect of Bytemode Bits on Emif AccessesBytemode Setting CPU Access to USB Register Emif System Control Register Escr 1C33hEmif Clock Divider Register Ecdr 1C26h 63. Emif Clock Divider Register Ecdr Field DescriptionsEdiv Products Applications DSPRfid

TMS3320C5515 specifications

The Texas Instruments TMS3320C5515 is a highly specialized digital signal processor (DSP) designed for a wide range of applications, including telecommunications, audio processing, and other signal-intensive tasks. As part of the TMS320 family of DSPs, the TMS3320C5515 leverages TI's extensive experience in signal processing technology, delivering robust performance and reliability.

One of the main features of the TMS3320C5515 is its 32-bit architecture, which allows for a high level of precision in digital signal computation. The processor is capable of executing complex mathematical algorithms, making it suitable for tasks that require high-speed data processing, such as speech recognition and audio filtering. With a native instruction set optimized for DSP applications, the TMS3320C5515 can perform multiply-accumulate operations in a single cycle, significantly enhancing computational efficiency.

The TMS3320C5515 employs advanced technologies including a Harvard architecture that separates instruction and data memory, enabling simultaneous access and improving performance. Its dual data buses enhance throughput by allowing multi-channel processing, making it particularly effective for real-time applications where timely data manipulation is critical. The device supports a wide range of peripherals, facilitating connections to various sensors and communication systems, which is vital in embedded applications.

In terms of characteristics, the TMS3320C5515 operates at an impressive clock speed, providing the computational power necessary to handle demanding tasks. The device is optimized for low power consumption, making it ideal for battery-operated applications without sacrificing performance. Its flexibility in processing algorithms also allows it to be readily adapted for specific requirements, from audio codecs to modems.

Another noteworthy aspect is the extensive development ecosystem surrounding the TMS3320C5515, which includes software tools, libraries, and support resources designed to accelerate the development process. This allows engineers and developers to bring their projects to market more quickly while minimizing risk.

Overall, the Texas Instruments TMS3320C5515 stands out as a powerful DSP solution, equipped with features that cater to the needs of various industries. Its combination of performance, efficiency, and versatile application makes it an attractive choice for engineers working in signal processing.
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