Intel MPCMM0002 manual Thermals, Processor Heat Sink, Module Orientation, Module Airflow Path

Thermals—MPCMM0002 CMM

11.0Thermals

11.1Processor Heat Sink

The MPCMM0002 CMM chassis management module has a heat sink on the 80321 processor to aid CMM cooling. This heat sink is a modified pin grid array as shown in Figure 29.

Figure 29. CMM Heat Sink

This heat sink provides similar cooling results with either a vertical or horizontal airflow.

11.2Module Orientation

The MPCMM0002 CMM module is designed to be installed in one of four orientations:

•Horizontal, with component side 1 up

•Horizontal, with component side 1 down

•Vertical, with component side 1 to the right

•Vertical, with component side 1 to the left

11.3Module Airflow Path

Regardless of the orientation, the airflow to the MPCMM0002 CMM module must follow one of two general patterns: front-to-back or side-to-side. Side-to-side airflow should be evenly distributed throughout the board, as shown in Figure 30 and Figure 31 below.

	Intel NetStructure® MPCMM0002 Chassis Management Module
July 2007	Hardware TPS
Order Number: 309247-004US	55