Intel MPCMM0002 manual Guidelines for Third Party Chassis Vendors, High Level Design

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MPCMM0002 CMM—Guidelines for Third Party Chassis Vendors

13.0Guidelines for Third Party Chassis Vendors

This chapter describes some of the high level design of the Intel NetStructure® MPCMM0002 Chassis Management Module to help third party chassis vendors better understand how to incorporate the CMM into their chassis.

Note: The chapter excludes any low level design details of the individual components of the Chassis Management Module or the CMM firmware. This chapter also does not explain how to configure the CMM to work in a third party chassis. That information is contained in the Intel NetStructure® MPCMM0001 Chassis Management Module and Intel NetStructure® MPCMM0002 CMM Software Technical Product Specification for version 6.1.

13.1High Level Design

At a very high level, the CMM can be thought of as a black box, which has 42 IPMB buses to allow a variety of bus topologies. The GPIO signals are for user-defined purposes, and the dedicated I/O signals are used for certain dedicated functionality explained later.

Figure 32 illustrates this high level CMM design.

Figure 32. High Level CMM Design

Dedicated I/O

Signals

CMM

10 GPIOs

 

 

 

42 IPMB Buses

The figure below provides next level of details on how these pins are wired to different components on the CMM hardware.

Intel NetStructure® MPCMM0002 Chassis Management Module

 

Hardware TPS

July 2007

62

Order Number: 309247-004US

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Contents Intel NetStructure MPCMM0002 Chassis Management Module Hardware Technical Product SpecificationOrder Number 309247-004US Contents 17.4 Tables FiguresOrder Number 309247-004US Date Revision Description Revision HistoryDocument Organization Acronyms and Terms Acronyms and TermsAcronym/Term Meaning Introduction Architecture SpecificationUser Documentation Product DefinitionMPCMM0002 CMM-Introduction Getting Started Installing the CMMQuick Start Module Components Block DiagramCMM Top View Layout Intel 80321 Processor Processor Features Sheet 1Pbga Processor Features Sheet 2Ethernet MemorySerial Port UARTs Fpga Features Watchdog TimerFpga Redundancy and Hot Swap CpldHot Swap Controller 10 ADM1026 ControllerRide-Through Support Ipmb Isolation LogicIpmb Dual Star Isolation Dual Bus Ipmb Isolation RequirementsFpga Mechanical Information DimensionsCMM Backing Plate Dimensions Front Panel Hardware CMM Side View DimensionsMPCMM0002 CMM Rear Connectors Rear Connector PlacementCoplanar Mating Connectors Vertical Mating ConnectorsDC Power Input CMM PowerBackplane Considerations Ipmb RoutingVoltage Max Where Used Monitored By Current CDM PowerVoltage Usage Filter Tray Power SwitchChassis Elements Directly Driven by CMM Hardware Ethernet RoutingChassis Component Element CMM Power Connector CMM Connector PinoutsRear Connections Pin Signal Purpose Pin Length Power Connector PinoutsPower Connector Receptacle Pin Placement Sheet 1 Power Connector Pinouts MatrixPin Staging Order Mating Tail Pin Code LengthRear Connections-MPCMM0002 CMM CMM Data Connector CMM Data ConnectorSignal Name Count Type Description Pin Name From Table Data Connector Pinouts Sheet 1Data Connector Pinouts Matrix Sheet 1 Data Connector Pinouts Sheet 2Data Connector Pinouts Matrix Sheet 2 Order Mating Length Tail Length Pin Code Data Connector Pinouts Matrix Sheet 3CMM Redundancy Guide PostMPCMM0002 CMM-Rear Connections CDM Overview Chassis Data Modules CDMsCDM Management CDM Health LED StatesCDM Redundancy CDM PowerSerial Port Pinouts Front PanelPin Signal Description Serial Port RJ-45 ConnectorEthernet Port Pinouts Ethernet Port PinoutsEthernet Port LED States Telco Alarm ConnectorLED Color Status Description Telco Alarm Pinout Cascading the Telco Alarm ConnectorsPin Description MxxReset Input Ganged Telco Alarm Cable Pinouts with Cabling Alarm Quiet SwitchLED Symbol Status Description Alarm LEDsLEDs Hot Swap LED Health LEDUser-Definable LEDs CMM Health LED StatesESD Discharge Protection Grounding ConsiderationsChassis Ground and Logic Ground Processor Heat Sink ThermalsModule Orientation Module Airflow PathSide-to-Side Air Flow Board Resistance Curve Airflow RequirementsTypical Airflow and Cooling Requirements Category CMMsAirflow Guidelines Thermal SensorsMinimum Air Flow Air Temp Rise Feature Summary Management Module Specifications12.3 Environmental Characteristics Dimensions and WeightDimensions and Weight Environmental CharacteristicsAssumptions and Notes Agency CertificationsReliability Estimate Data Reliability Measure Value UnitsHigh Level Design Guidelines for Third Party Chassis VendorsIpmb Buses O Signals of the CMMPhysical Bus Number Mapping Ipmb Signal Physical Bus NumberRadial Bus Topologya Dedicated I/O Pins Gpio PinsInterfacing FRUs to the CMM Example ConfigurationsNon-Intelligent FRUs with I2C* Support Intelligent FRUsFRUs Based on the ADM1026 Non-Intelligent FRUs without I2C Support Two-Wire Serial Interface BasedFRU Data Storage for Non-Intelligent Devices Controllers and I/O Ports for Non-Intelligent Devices Temperature Sensors Fronted by the CMMRelated Documents Related DocumentsReturning a Defective Product RMA Warranty InformationFor Europe, Middle East, and Africa Emea For the AmericasFor Asia and Pacific Apac Warranty Information-MPCMM0002 CMM Customer Support Technical Support and Return for Service AssistanceCustomer Support Sales AssistanceCertifications Material Declaration Data SheetMaterial Declaration Data Sheet North America FCC Class a Agency InformationTaiwan Class a Warning Statement Safety Instructions English and French-translated belowEnglish FrenchJapan Vcci Class a Korean Class a Australia, New Zealand Safety Warnings Mesures de Sécurité MPCMM0002 CMM-Safety Warnings Sicherheitshinweise MPCMM0002 CMM-Safety Warnings Norme di Sicurezza MPCMM0002 CMM-Safety Warnings Instrucciones de Seguridad MPCMM0002 CMM-Safety Warnings Chinese Safety Warning MPCMM0002 CMM-Safety Warnings Fpga Working page only. Do not distribute Working page only. Do not distribute Working page only. Do not distribute