Intel MPCMM0002 manual Working page only. Do not distribute

Working page only. Do not distribute.

11.0 Thermals		55
11.1	Processor Heat Sink	55
11.2	Module Orientation	55
11.3	Module Airflow Path	55
11.4	Airflow Requirements	57
11.5	Board Resistance Curve	57
11.6	Thermal Sensors	58
12.0 Management Module Specifications		59
12.1	Feature Summary	59
12.2	Dimensions and Weight	60
12.3	Environmental Characteristics	60
12.4	Product Reliability Estimate	60
12.5	Agency Certifications	61
13.0 Guidelines for Third Party Chassis Vendors		62
13.1	High Level Design	62
13.2	IPMB Buses	63
13.3	GPIO Pins	66
13.4	Interfacing FRUs to the CMM	67
13.5	Intelligent FRUs	68
13.6	Non-Intelligent FRUs with I2C* Support	68
13.7	Non-Intelligent FRUs without I2C Support	69
13.8	FRU Data Storage for Non-Intelligent Devices	69
13.9	Controllers and I/O Ports for Non-Intelligent Devices	70
13.10	Temperature Sensors Fronted by the CMM	70
13.11	Related Documents	70
14.0 Warranty Information		71
14.1	Intel NetStructure® Compute Boards & Platform Products Limited Warranty	71
14.2	Returning a Defective Product (RMA)	71
14.3	For the Americas	72
15.0 Customer Support		74
15.1	Customer Support	74
15.2	Technical Support and Return for Service Assistance	74
15.3	Sales Assistance	74
15.4	Product Code Summary	74
16.0 Certifications		75
16.1	Material Declaration Data Sheet	75
17.0 Agency Information		77
17.1	North America (FCC Class A)	77

17.2Canada – Industry Canada (ICES-003 Class A) (English and French-translated below) 77

17.3	Safety Instructions (English and French-translated below)	78
17.4	Taiwan Class A Warning Statement	78
17.5	Japan VCCI Class A	79
17.6	Korean Class A	79
17.7	Australia, New Zealand	79
18.0 Safety Warnings		80
18.1	Mesures de Sécurité	81
18.2	Sicherheitshinweise	83
18.3	Norme di Sicurezza	85
18.4	Instrucciones de Seguridad	87
18.5	Chinese Safety Warning	89

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